iNand IX EM132 – Industrial Embedded Flash Device. The Industrial iNAND IX EM132 Embedded Flash Drive (EFD) is Western Digital’s most advanced e.MMC flash storage solution for industrial applications, with high reliability and endurance across a wide range of operational requirements. Designed and tested to withstand demanding environmental conditions, this industrial- grade flash device features advanced […]
WESTERN DIGITAL INAND IX EM132 Continue Reading
Miromico AG has developed a LoRaWAN module with integrated Arm Cortex-M4 microcontroller, which was unveiled at Embedded World 2020. They claim it is the world’s smallest LoRaWAN module with integrated Arm Cortex-M4 microcontroller. Also referred to as the FMLR-6x-x-MA62x Module, Miromico module’s latest design is built around the Maxim MAX23625/26 microcontroller, which enables an Arm Cortex-M4, clocking at up to 96MHz from the internal oscillator of as low
MIROMICO’S FMLR-6X-X-MA62X, THE “WORLD’S SMALLEST” LORAWAN MODULE Continue Reading
The STM32H7A3/7B3 lines of microcontrollers include an Arm® Cortex®-M7 core (with double-precision floating point unit) running up to 280 MHz. The STM32H7A3/7B3 MCU lines provides 1 to 2 Mbytes Flash memory, 1.4 Mbytes of SRAM with the following architecture: 192 Kbytes of TCM RAM (including 64 Kbytes of ITCM RAM and 128 Kbytes of DTCM
NXP Semiconductors today announced the availability of its LPC551x/S1x microcontroller (MCU) family – further extending its performance-efficient LPC5500 MCU series. The LPC551x/S1x MCU family offers developers low power consumption, embedded security, pin-, software- and peripheral-compatibility to accelerate time-to-market. The LPC551x/S1x family leverages ultra-efficient 40-nm flash technology for cost and performance benefits. Key features include: Over 600 EEMBC® CoreMarks®
Barely a week after Lattice semiconductor announced the launch of the CrossLink-NX family of FPGA, Greg Davill, in his amazing way of posting the entire development process in a twitter thread, has announced the launch of a development board based on the Lattice Crosslink-NX 72QFN. The new board which is called the ArcticKoala was created using some of the sources from recent FPGA tools like
MEET THE ARTICKOALA! THE FPGA DEVELOPMENT BOARD BASED ON LATTICE CROSSLINK-NX Continue Reading
When working on projects with computation-intensive routines and (or) near real-time performance requirements, having a “lightning-fast” RAM is usually a good thing for developers. This is one of the reasons while STMicro included the Core Coupled Memory (CCM) RAM in a good number of its STM32 microcontroller series, and Dim Tass recently demonstrated how to use it, in a blog post
BOOST THE SPEED OF YOUR STM32 MICROCONTROLLERS BY 31% USING CORE-COUPLED MEMORY Continue Reading
Engineer and developer Alex Tan based in Singapore has launched a new Kickstarter crowdfunding campaign for the SAMD21 M0+ Arduino-compatible board. Featuring a 32-bit 48MHz ARM Cortex M0+ w/ internal 32K Ram 256K Flash, 8M Ram 128M Flash onboard and more. “I have sourced and used many microcontroller boards for many projects and very often
SAMD21 M0+ mini Arduino compatible board now offers more power Continue Reading
Espressif announces the release of the ESP32-S2 Secure Wi-Fi MCU, which is a highly integrated, low-power, 2.4 GHz Wi-Fi Microcontroller SoC supporting Wi-Fi HT40 and 43 GPIOs. Based on Xtensa® single-core 32-bit LX7 processor, ESP32-S2 can be clocked at up to 240 MHz. ESP32-S2 is a highly integrated, low-power, 2.4 GHz Wi-Fi Microcontroller SoC supporting
ESPRESSIF ANNOUNCES THE RELEASE OF ESP32-S2 SECURE WI-FI MCU Continue Reading
Ohio based company, Estone Technology (AKA Habey) has updated the product page for the new EMB-2610 Pico-ITX SBC. The EMB-2610 follows earlier Habey Pico-ITX SBCs such as last year’s i.MX6 UL powered EMB-2200 and i.MX6 based EMB-2230. This time Estone has used a 14nm Intel Atom SoC. Rather than going with Apollo Lake, they used the quad-core, 1.92GHz Atom x5-Z8350
EMB-2610 Pico-ITX SBC Runs Linux and comes with Touch Panel Continue Reading
SK Hynix Incorporated introduced the world’s first 72-Layer 256Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies. This company also launched 6-Layer 128Gb 3D NAND chips in April 2016 and has been mass producing 48-Layer 256Gb 3D NAND chips since November 2016. Within 5 months the researchers in SK
SK Hynix Introduces Industry’s Highest 72-Layer 3D NAND Flash Continue Reading
