Summary of SK Hynix Introduces Industry’s Highest 72-Layer 3D NAND Flash
SK Hynix unveiled the world's first 72-Layer 256Gb 3D NAND Flash using TLC arrays. This breakthrough stacks 1.5 times more cells than its 48-layer predecessor, delivering 30% higher productivity efficiency and 20% better read/write performance. Designed for low power consumption and high reliability, these chips target SSDs and mobile devices like smartphones. Mass production is scheduled for the second half of the year to support global storage solutions and diversify SK Hynix's business beyond DRAM.
Parts used in the 72-Layer 3D NAND Flash:
- 72-Layer 3D NAND Flash chip
- TLC (Triple-Level Cell) arrays
- SSD (Solid State Drive)
- Mobile device storage components
- Smartphone storage modules
SK Hynix Incorporated introduced the world’s first 72-Layer 256Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies. This company also launched 6-Layer 128Gb 3D NAND chips in April 2016 and has been mass producing 48-Layer 256Gb 3D NAND chips since November 2016. Within 5 months the researchers in SK Hynix developed the new technology of producing 72-layer 3D NAND flash.
The technological achievement of this 72-Layer 3D NAND is compared to the difficulty of building approximately 4 billion 72-storied skyscrapers on a single dime. Well, now the question maybe, “Is the difficulty and complexity of this new technology giving any remarkable outcome?”. The answer is a big YES. The 72-layer NAND is said to stack 1.5 times more cells than the 48-layer, achieving 30% more efficiency in productivity and 20% higher read/write performance than a 48-layer 3D NAND chip, the predecessor of this 72-layer .D 256Gb NAND flash.
With this new chips having 30% more efficiency in productivity and 20% higher performance, SK Hynix has been currently developing NAND Flash solutions such as SSD (Solid State Drive) and storage for mobile devices such as smartphones. Having high reliability and low power consumption this 3D NAND flash should be an ideal solution for storage problems of mobile devices.
SK Hynix plans to expand the usage of the product to SSDs and mobile gadgets to further improve its business structure weighted towards DRAM. The vice president Jong Ho Kim said in the press release,
With the introduction of this industry’s highest productivity 3D NAND, SK Hynix will mass produce the 256Gb 3D NAND in the second half of this year to provide this to worldwide business clients for optimum use in storage solutions
Read more: SK Hynix Introduces Industry’s Highest 72-Layer 3D NAND Flash
- What is the main achievement of SK Hynix?
SK Hynix introduced the world's first 72-Layer 256Gb 3D NAND Flash based on TLC arrays. - How much more efficient is the 72-layer compared to the 48-layer version?
The 72-layer NAND achieves 30% more efficiency in productivity than the 48-layer chip. - Does the new technology offer better performance?
Yes, it provides 20% higher read/write performance than the 48-layer 3D NAND chip. - Can this technology be used in smartphones?
Yes, it is being developed as an ideal solution for storage problems in mobile devices such as smartphones. - What are the key benefits for mobile devices?
The chips offer high reliability and low power consumption. - When will mass production begin?
Mass production is planned for the second half of the year. - Why is SK Hynix expanding into SSDs and mobile gadgets?
The company aims to improve its business structure which is currently weighted towards DRAM. - Who stated the plan for worldwide business clients?
Vice President Jong Ho Kim announced that the product would be provided to worldwide business clients.
