thermal

THERMAL PACKAGED MOSFET TARGETS E BIKE POWER SYSTEMS

THERMAL-PACKAGED MOSFET TARGETS E-BIKE POWER SYSTEMS

Analog and mixed-signal semiconductor company MagnaChip Semiconductor (Cheongju-si, South Korea) has announced the release of a 100-V mid-voltage MOSFET with a new thermal package designed for the fast-growing electric bike (e-bike) market. The MOSFET is housed in a M2PAK-7P package suitable to meet the particular requirements of electric bike (e-bike) systems, which are powered by electric motors

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INCANDESCENT LIGHT BULBS AT THE NANOSCALE

INCANDESCENT LIGHT BULBS AT THE NANOSCALE

Using tiny arrays of carbon nanotubes, a team of researchers at Rice University has designed nanoscale incandescent light source that could be tuned to precisely emit at specific wavelength, based on the materials’ configuration. The so-called nanoscale thermal emitters described in a paper titled “Non‐Hermitian Selective Thermal Emitters using Metal–Semiconductor Hybrid Resonators” published in the journal of

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ADVANTECH LAUNCHES HIGH PERFORMANCE COM EXPRESS SOM 5899

ADVANTECH LAUNCHES HIGH-PERFORMANCE COM EXPRESS SOM-5899

Advantech, a world leader in embedded IoT, is pleased to announce the launch of its high-end SOM-5899 series COM Express Type 6 Module designed with 8th and 9th Gen Intel® Core™ H-series processors. Compared with previous generations, the SOM-5899 is enhanced with six cores for better multithreaded performance in compute-intensive applications. With a dual channel 96GB ECC and non-ECC

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QIANLI LC IRP01 THERMAL VISIBLE MICROSCOPE FOR PCB REPAIR

QIANLI LC-IRP01 THERMAL/VISIBLE MICROSCOPE FOR PCB REPAIR

The QianLi’s 160×120 thermal imaging sensor and 1920×1080 visible sensor combine to make a powerful circuit board repair tool, especially helpful in finding overheating or short-circuit issues. Saelig Co. Inc. has introduced the QianLi LC-IRP01 Thermal Imaging Camera, a diagnostic tool for PCBs which displays heat images to help identify damaged or malfunctioning components or short-circuits. 

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HIGH THERMAL RESOLUTION HIGH FRAME RATE LOW COST THERMAL INSPECTION CAMERA

HIGH THERMAL RESOLUTION, HIGH FRAME RATE, LOW COST THERMAL INSPECTION CAMERA

The Fotric 326 provides high quality radiometric images full of detailed thermal information in a handheld pistol-grip camera for investigative analysis Saelig Company, Inc. (www.saelig.com) has introduced the FOTRIC 326 Thermal Imaging Camera – a rugged, durable, accurate, and portable handheld heat investigation device, designed for a wide range of equipment and infrastructure thermal diagnostic tasks.  The 326

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100MA FIXED VOLTAGE REGULATORS ARE RUGGED AND INEXPENSIVE

100MA FIXED-VOLTAGE REGULATORS ARE RUGGED AND INEXPENSIVE

ON Semiconductor’s MC78L series of fixed-voltage regulators are inexpensive, easy-to-use devices suitable for a multitude of applications that require a regulated supply current of up to 100mA. Like their higher-powered MC7800 and MC78M00 series cousins, these regulators feature internal current limiting and thermal shut-down protection, making them remarkably rugged. They are available in fixed output-voltage

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OURPCB PUBLISHED A NEW ARTICLE “HOW TO CHOOSE PCB SUBSTRATE MATERIAL”

OURPCB PUBLISHED A NEW ARTICLE: “HOW TO CHOOSE PCB SUBSTRATE MATERIAL”

SHIJIAZHUANG, China, July 11, 2019 (Newswire.com) –OurPCB, a multi-national PCB Manufacturing, and PCB Assembly company, The publication is available on the https://www.ourpcb.com/pcb-substrate-material.html section of the company’s website for free. It has six chapters that cover every detail about PCB Substrate Material. Among the key subjects on PCB Substrate Material include: Copper Foil Requirements: This section gives a brief overview of

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X FAB INTRODUCES HIGHLY SENSITIVE SPAD AND APD DEVICES BASED ON ITS MODULAR 180NM PROCESS TECHNOLOGY

X-FAB INTRODUCES HIGHLY-SENSITIVE SPAD AND APD DEVICES BASED ON ITS MODULAR 180NM PROCESS TECHNOLOGY

X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, continues to develop ground-breaking semiconductor solutions to address the most difficult of design challenges. It has now announced the availability of avalanche photodiode (APD) and single-photon avalanche diode (SPAD) products for implementation in scenarios where there are extremely low light conditions to contend with and augmented

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