Summary of SimScale is Teaching Electronics Engineers How to Test Designs with Cloud-based CFD
SimScale offers a free 30-minute webinar on January 24 where CEO David Heiny will demonstrate how cloud-based conjugate heat transfer simulation helps electronics engineers investigate thermal response of electronic packaging using only a web browser, enabling faster, cheaper design validation and reduced overheating risks in high-power density electronics.
Parts used in theSimScale Webinar Project:
- Web browser
- Cloud-based SimScale platform
- Conjugate heat transfer simulation capability
- Internet connection
- Webinar presentation (30-minute format)
- Presenter: SimScale CEO David Heiny
SimScale is announcing a free webinar on 24th of January to teach electronics engineers how conjugate heat transfer simulation in the cloud can help better investigate the thermal response of electronic packaging.
According to the Electrical and Electronic Manufacturing Market Briefing 2017 report from The Business Research Company (TBRC), the global electrical and electronics manufacturing market is expected to reach $3 trillion by 2020.
In such an innovation-driven and competitive industry, engineers deal with increasingly stringent thermal requirements due to the rapid increase in high-power density electronics. Thermal integrity is one of the most important considerations for electronics packaging or enclosures that affect the product lifecycle. The thermal impact on the electronic packaging is a key factor in material selection, cooling and form-related decisions that eventually determine the weight, size, and cost of the final design. It is vital for designers to determine the heat signatures of their system.
This can be done with the help of engineering simulation or computer aided engineering, saving weeks of design time and thousands of dollars in costs. Simulation, nevertheless, has been until recently expensive to use itself, and this a reason many engineers preferred to rely on hand calculations rather than invest over $40k in hardware and licenses of on-premises software.
Cloud-based solutions have challenged the status-quo in recent years, however, and SimScale is one of the companies leading the democratization of computer-aided engineering. Based in Germany, the company makes very complex simulations easy and accessible to everyone around the globe.
In a free 30-minute webinar on January 24th, SimScale’s CEO David Heiny will explain how conjugate heat transfer simulation with SimScale can help engineers better investigate the thermal response of electronic packaging by using only a web browser. This will allow them to troubleshoot and minimize their recurrent problems of electronics failure risks due to overheating.
Read more: SimScale is Teaching Electronics Engineers How to Test Designs with Cloud-based CFD
- What is the webinar about?
The webinar explains how conjugate heat transfer simulation in the cloud can help investigate the thermal response of electronic packaging. - When is the webinar scheduled?
The webinar is scheduled for January 24 and lasts 30 minutes. - Who will present the webinar?
The webinar will be presented by SimScale CEO David Heiny. - What tools are required to attend the webinar?
You need a web browser and an internet connection to access the cloud-based SimScale demonstration. - How does SimScale make simulation accessible?
SimScale provides cloud-based simulation that runs in a web browser, avoiding large on-premises hardware and license investments. - Why is thermal simulation important for electronic packaging?
Thermal simulation helps determine heat signatures, informs material selection, cooling and form decisions, and reduces electronics failure risks due to overheating. - Can conjugate heat transfer simulation reduce design time and cost?
Yes, engineering simulation can save weeks of design time and thousands of dollars compared to traditional methods. - What industry trend increases the need for thermal simulation?
The rapid increase in high-power density electronics creates more stringent thermal requirements for designs.
