technology

NEXPERIA RELEASES NEW GAN FET DEVICES1

NEXPERIA RELEASES NEW GAN FET DEVICES

Nexperia released a new set of GaN FET devices (650 V GAN041-650WSB in TO-247 and GAN039-650NBB in CCPAK) that feature the company’s high-voltage GaN HEMT H2 technology in both TO-247 and the company’s proprietary CCPAK surface mount packaging. The cascode within the devices allows for higher levels of switching FOMs and on-state performance.Features of the new GaN FET devices, per a […]

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Making Sounds with Arduino

Making Sounds with Arduino

The limited funding and job opportunities in the humanities field make it challenging for emerging scholars to pursue additional knowledge. As scholars must acquire extensive knowledge within their respective disciplines, they must also create coherent projects within an academic context. This situation creates difficulties for educators to learn and develop technology-related curriculum. However, there is

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MEET THE BREADBOARD COMPATIBLE MCP4901 DAC BASED BREAKOUT BOARD

MEET THE BREADBOARD COMPATIBLE MCP4901 DAC BASED BREAKOUT BOARD

US-based technology Product development company, Earth People Technology, recently announced the launch of a DAC (digital to analog converter) breakout board that is based on the popular eight-bit MCP4901 DAC Chip. The new breakout board, in line with the nature of the products developed by the company, comes with breadboard compatibility which makes it easy to use for

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Rohm claims to have smallest transistor package

Rohm claims to have smallest transistor package

ROHM Semiconductor Ultra Compact MOSFETs & Bipolar Transistors have the smallest transistor package on the market which is optimized for thin, compact portable devices. The VML0806 case type measures just 0.8mm×0.6mm, with a height of only 0.36mm. As portable devices, such as smartphones and digital cameras get smaller and more sophisticated, thinner, more compact components

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Microsemi has very low power RF chip for patient monitors

Microsemi very low power RF chip for patient monitors

The ZL70250 ultra-low-power radio frequency (RF) transceiver provides a wireless link in applications where power consumption is of primary importance. The transceiver’s ultra low-power requirements allow battery miniaturization or the use of energy-harvesting methods, enabling devices with an extremely small form factor. The availability of the transceiver in a CSP form factor combined with the

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What is SIP trunking and how can it help your business

What is SIP trunking and how can it help your business?

Are you searching for an efficient and cost-effective way to boost key aspects of your business’s daily operations? If so, look no further than SIP (session initiation protocol) trunking technology; an innovative and cost-efficient telecommunications solution that has transformed how businesses communicate, helping them remain competitive in today’s digital environment. Taking advantage of SIP trunking

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Dual diode controller replaces two high power Schottkys

Dual diode controller two high power Schottkys replaces

Description The LTC®4353 controls external N-channel MOSFETs to implement an ideal diode function. It replaces two high power Schottky diodes and their associated heat sinks, saving power and board area. The ideal diode function permits low loss power supply ORing and supply holdup applications. The LTC4353 regulates the forward-voltage drop across the MOSFET to ensure

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NXP introduces tiny mosfet in leadless package

NXP introduces tiny mosfet in leadless package

Description N-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. Features and benefits Trench MOSFET technology Very fast switching Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm Exposed drain pad for excellent thermal conduction Tin-plated 100

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