Summary of Rohm claims to have smallest transistor package
ROHM developed the VML0806, the smallest transistor package available (0.8mm × 0.6mm × 0.36mm), optimized for thin, compact portable devices. By using a smaller internal element and high-precision packaging processes, ROHM overcame miniaturization, bonding stability, and SMT challenges that limited prior smallest devices to 1006 size. Initially released for small-signal MOSFETs, the package offers bottom-terminal design, reduced ON resistance (2.6 Ω in MOSFET form), and a 67% smaller mounting area versus 1212-size transistors. Future versions will include bipolar and digital transistors.
Parts used in the VML0806 transistor package project:
- VML0806 transistor package (0.8mm × 0.6mm × 0.36mm)
- Small-signal MOSFET die/element (miniaturized)
- Bottom-terminal package substrate
- High-precision package process tooling
- Bonding materials for internal connections
- Surface mount technology (SMT) compatible pads
- Assembly and inspection equipment for high-precision packaging
ROHM Semiconductor Ultra Compact MOSFETs & Bipolar Transistors have the smallest transistor package on the market which is optimized for thin, compact portable devices. The VML0806 case type measures just 0.8mm×0.6mm, with a height of only 0.36mm. As portable devices, such as smartphones and digital cameras get smaller and more sophisticated, thinner, more compact components are required. Until now, problems related to internal element miniaturization, bonding stability, package process accuracy, and surface mount technology limit the smallest conventional transistors to the 1006 size (1.0mm×0.6mm, t=0.37mm). ROHM was able to overcome these challenges by utilizing a smaller element and high-precision package process technology, resulting in an unprecedentedly compact form factor.
Features
- Industry-small size minimizes mounting area
- Compared to the smallest conventional small-signal transistor
- available (1212 size: 1.2mm×1.2mm, t=0.50mm), mounting area is reduced 67% and thickness 28%
- Bottom-terminal design supports high-density mounting
- Reduced MOSFET ON resistance
- Low ON resistance (2.6Ω）is enabled in an ultra-compact form factor
Rohm Semiconductor says it has developed the smallest transistor package on the market. The VML0806 measures just 0.8mm x 0.6mm, with a height of only 0.36mm.
With current miniaturisation, bonding stability, package process accuracy, and surface mount technology, the smallest conventional transistors are the 1006 size (1.0mm x 0.6mm x 0.37mm).
Rohm says it has overcome these challenges by using a smaller element and high-precision package process technology.
Rohm will initially offer this new package for small-signal mosfets.
Future implementations will include bipolar and digital transistors.
For more read: Rohm claims to have smallest transistor package
- What are the dimensions of the VML0806 package?
The VML0806 measures 0.8mm × 0.6mm with a height of 0.36mm. - What problem does the VML0806 address?
It addresses the need for thinner, more compact components for portable devices by reducing package size and mounting area. - How much smaller is the VML0806 compared to 1212-size transistors?
The mounting area is reduced by 67% and thickness by 28% compared to 1212-size transistors. - What type of transistor is ROHM initially offering in the VML0806 package?
ROHM will initially offer the VML0806 for small-signal MOSFETs. - Will other transistor types use the VML0806 package?
Yes, future implementations will include bipolar and digital transistors. - What design feature supports high-density mounting?
The package uses a bottom-terminal design to support high-density mounting. - What ON resistance is achieved in the ultra-compact MOSFET?
The ultra-compact MOSFET achieves a low ON resistance of 2.6 Ω. - How did ROHM overcome miniaturization challenges?
ROHM used a smaller internal element and high-precision package process technology to overcome challenges like bonding stability and package process accuracy.
