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WAFER LEVEL CAMERA MODULE MEASURES ONLY 0.65 X 0.65 X 1.158MM

WAFER-LEVEL CAMERA MODULE MEASURES ONLY 0.65 X 0.65 X 1.158MM

OmniVision Technologies has released a fully packaged, wafer-level camera module measuring just 0.65×0.65mm and 1.158mm tall. Built around the company’s Guinness World Record breaking image sensor, only 0.575mm by 0.575mm, the OVM6948 CameraCubeChip was developed as a disposable medical imager, preventing cross-contamination risks while providing deeper anatomical access without being too invasive. OmniVision Technologies, Inc., a

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INTRINSYC ANNOUNCES NEW PREMIUM TIER SYSTEM ON MODULE BASED ON QUALCOMM TECHNOLOGIES’ SDA845 SYSTEM ON CHIP

INTRINSYC ANNOUNCES NEW PREMIUM-TIER SYSTEM ON MODULE BASED ON QUALCOMM TECHNOLOGIES’ SDA845 SYSTEM ON CHIP

Designed for use in Advanced Robotics and Drones, Premium Camera Applications, Artificial Intelligence Platforms, and other Cutting-edge IoT Devices. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the Open-Q™ 845 µSOM (micro System on Module) and Development Kit, to be

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TORADEX ANNOUNCES ITS APALIS SOM BASED ON THE NXP I.MX 8QUADMAX APPLICATIONS PROCESSOR

TORADEX ANNOUNCES ITS APALIS SOM BASED ON THE NXP I.MX 8QUADMAX APPLICATIONS PROCESSOR

Toradex, a leader in embedded computing, announced today general availability for its Apalis System on Module (SoM) based on the NXP® i.MX 8QuadMax applications processor. The SoM has been available as part of Toradex’s ‘early access’ program to its key partners and customers for several months and has a minimum product availability until 2030. The SoM is pin-compatible

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