This is an example to show how to get sensor data from a remote Arduino via Wireless Lora Protocol. The exampels requries below hardwares: 1) Client Side: Arduino + Lora Shield (868Mhz) + DS18B20 (Temperature Sensor). 2) Server Side: Arduino + Lora Shield (868Mhz) + Yun Shield + USB flash. make sure the USB […]
How to get sensor data from a remote Arduino via Wireless Lora Protocol Read More »
When working on projects with computation-intensive routines and (or) near real-time performance requirements, having a “lightning-fast” RAM is usually a good thing for developers. This is one of the reasons while STMicro included the Core Coupled Memory (CCM) RAM in a good number of its STM32 microcontroller series, and Dim Tass recently demonstrated how to use it, in a blog post
BOOST THE SPEED OF YOUR STM32 MICROCONTROLLERS BY 31% USING CORE-COUPLED MEMORY Read More »
Barely a week after Lattice semiconductor announced the launch of the CrossLink-NX family of FPGA, Greg Davill, in his amazing way of posting the entire development process in a twitter thread, has announced the launch of a development board based on the Lattice Crosslink-NX 72QFN. The new board which is called the ArcticKoala was created using some of the sources from recent FPGA tools like
MEET THE ARTICKOALA! THE FPGA DEVELOPMENT BOARD BASED ON LATTICE CROSSLINK-NX Read More »
NXP Semiconductors today announced the availability of its LPC551x/S1x microcontroller (MCU) family – further extending its performance-efficient LPC5500 MCU series. The LPC551x/S1x MCU family offers developers low power consumption, embedded security, pin-, software- and peripheral-compatibility to accelerate time-to-market. The LPC551x/S1x family leverages ultra-efficient 40-nm flash technology for cost and performance benefits. Key features include: Over 600 EEMBC® CoreMarks®
NXP ANNOUNCES GENERAL AVAILABILITY OF THE ARM CORTEX-M33-BASED LPC551X S1X MCU FAMILY Read More »
The STM32H7A3/7B3 lines of microcontrollers include an Arm® Cortex®-M7 core (with double-precision floating point unit) running up to 280 MHz. The STM32H7A3/7B3 MCU lines provides 1 to 2 Mbytes Flash memory, 1.4 Mbytes of SRAM with the following architecture: 192 Kbytes of TCM RAM (including 64 Kbytes of ITCM RAM and 128 Kbytes of DTCM
Like many of you, we’ve been keeping a close eye on the CH32 family of RISC-V microcontrollers from WCH Electronics. You can get the CH32V003, featuring 2 kB RAM and 16 kB of flash for under fifteen cents, and the higher-end models include impressive features like onboard Ethernet. But while the hardware is definitely interesting,
CH32 RISC-V MCUS GET OFFICIAL ARDUINO SUPPORT Read More »
What’s the difference between a 64k ROM in a 28-pin DIP and a 128k ROM in a 32-pin DIP? Aside from the obvious answers of “64k” and “four pins,” it turns out that these two chips have a lot in common, enough so that it only takes a little bodging to make them interchangeable — more or
STUFFING A 32-PIN CHIP INTO A 28-PIN SOCKET Read More »
Miromico AG has developed a LoRaWAN module with integrated Arm Cortex-M4 microcontroller, which was unveiled at Embedded World 2020. They claim it is the world’s smallest LoRaWAN module with integrated Arm Cortex-M4 microcontroller. Also referred to as the FMLR-6x-x-MA62x Module, Miromico module’s latest design is built around the Maxim MAX23625/26 microcontroller, which enables an Arm Cortex-M4, clocking at up to 96MHz from the internal oscillator of as low
MIROMICO’S FMLR-6X-X-MA62X, THE “WORLD’S SMALLEST” LORAWAN MODULE Read More »
F&S Elektronik Systeme GmbH presents a prototype of a direct solder module. It’a a 30 x 30mm “OSM-MX8MM” module that runs Linux on an i.MX8M Mini. As part of the SGET, the standardization group SDT.05 was founded jointly by iesy GmbH, F&S Elektronik Systeme GmbH and Kontron AG. The aim of this group is a new standard
OSM (OPEN STANDARD MODULE) WITH NXP I.MX 8M MINI / NANO CPU Read More »
New generation 3D flash memory adds layers, boosts capacity, broader bandwidth and provides new design flexibility KIOXIA Europe GmbH, the world leader in memory solutions, today announced that it has successfully developed its fifth-generation BiCS FLASH three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. KIOXIA plans to start shipping samples of the new device, which has a
KIOXIA UNVEILS FIFTH-GENERATION BICS FLASH Read More »
