devices

MICROSOFT AI DEVELOPER KIT RUNS LINUX ON QUALCOMM SOC

MICROSOFT AI DEVELOPER KIT RUNS LINUX ON QUALCOMM SOC

Electronics News Updates / By

Microsoft has announced a $249 “Vision AI Developer Kit, aimed at AI edge developers using Azure IoT Edge and Azure Machine Learning. The kit features an 8MP, 4K camera which runs Linux on Qualcomm’s 10nm, AI-enabled QCS603 SoC. The Vision AI Developer Kit incorporates Qualcomm’s Vision Intelligence Platform, which is infused into its QCS603 SoC, with Microsoft’s Azure IoT Edge service, built on […]

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Arduino Cloud updates for tags filters blinks and galleries

Arduino Cloud updates for tags, filters, blinks and galleries

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The official Arduino development team has this week rolled out new Arduino Cloud updates for tags, filters, blinks and galleries enhancing the workflow of the cloud IDE. Tags introduced a new way to filter your Things based on your custom metadata, templates has also been enhanced further with new broader templates (which support a whole variety of boards; not

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TDK INVENSENSE MOD CH101 ULTRASONIC TOF SENSOR MODULE

TDK INVENSENSE MOD-CH101 ULTRASONIC TOF SENSOR MODULE

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Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the MOD_CH101 ultrasonic time-of-flight (ToF) sensor module and DK-CH101 SmartSonic™ platform from InvenSense, a TDK Group company. The ToF solutions offer fast and accurate range measurement with ultra-low power consumption, and are capable of detecting objects of any

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COM WHUC6 INDUSTRIAL POWER ON MODULE FROM AAEON

COM-WHUC6: INDUSTRIAL POWER ON MODULE FROM AAEON

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AAEON, an industry leader in embedded computing, announces the COM-WHUC6 COM Express module. Built to the Compact Type 6 form factor, the COM-WHUC6 is designed to operate in a range of applications from automation to mobile operations. The COM-WHUC6 is powered by the 8th Generation Intel® Core™ i7/i5/i3 and Celeron® ULT series processors (formerly Whiskey Lake), providing energy efficient

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3D IMAGE SENSOR REAL3 FOR FACE AUTHENTICATION ANNOUNCED AT CES 2020

3D IMAGE SENSOR REAL3 FOR FACE AUTHENTICATION ANNOUNCED AT CES 2020

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Infineon Technologies AG has collaborated with software and 3D Time-of-Flight (ToF) system specialist pmdtechnologies ag to develop reportedly the world’s smallest, most powerful 3D image sensor. Designated the REAL3, the single-chip solution measures just 4.4 x 5.1 mm and is the fifth generation of time-of-flight deep sensors from Infineon. The sensor can be incorporated into even the smallest devices with just

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NEXCOM NDIS V1000 THE 4K DIGITAL SIGNAGE PLAYER

NEXCOM NDIS V1000: THE 4K DIGITAL SIGNAGE PLAYER

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Vibrant, 4k resolution multi-displays come to life with NEXCOM’s new NDiS V1000 digital signage player. Powered by AMD’s APU microprocessor, the seamlessly integrated CPU and GPU result in a high performance yet lower-power device perfect for retail environments – and even private use. The value-added and scalable NDiS V1000’s compact design is the result of customer feedback, with

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