devices

BLUETERA II – FULL-STACK DEV BOARD THAT USES PROTOCOL BUFFERS FOR MOTION-BASED IOT APPLICATIONS

Many of our clients face a common challenge when undertaking IoT projects. They are experts in their own fields, and most of of them have a great idea, a proof-of-concept (PoC), or a sophisticated algorithm that addresses some specific need. They have simulated their solution in Matlab or Python and are eager to build and …

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NEW CHIP BRINGS ULTRA-LOW POWER WIFI CONNECTIVITY TO IOT DEVICES.

Electrical engineers from the University of California, San Diego recently designed a new portable chip that consumes 5000 less power than the Wi-Fi radios that we have today. The new chip, which is smaller in size compared with a grain of rice, is said to be ideal for IoT devices, smart home setups, and wearables. With just 28 microwatts …

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COOLSIC™ MOSFET 650 V FAMILY OFFERS BEST RELIABILITY AND PERFORMANCE TO EVEN MORE APPLICATIONS

Infineon Technologies AG continues to expand its comprehensive silicon carbide (SiC) product portfolio with 650 V devices. With the newly launched CoolSiC™ MOSFETs Infineon is addressing the growing demand for energy efficiency, power density, and robustness in a wide range of applications. Amongst them are server, telecom and industrial SMPS, solar energy systems, energy storage and battery formation, UPS, motor …

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TI’S EMI-OPTIMIZED INTEGRATED TRANSFORMER TECHNOLOGY MINIATURIZES ISOLATED POWER TRANSFER INTO IC-SIZED PACKAGING

Engineers can shrink their power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with a new high-density, isolated DC/DC bias power supply. Texas Instruments (TI) introduced the first integrated circuit (IC) developed with a new proprietary integrated transformer technology: a 500-mW high-efficiency isolated DC/DC converter with the industry’s lowest electromagnetic interference (EMI), the UCC12050. …

TI’S EMI-OPTIMIZED INTEGRATED TRANSFORMER TECHNOLOGY MINIATURIZES ISOLATED POWER TRANSFER INTO IC-SIZED PACKAGING Read More »

ADVANTECH LAUNCHES NXP I.MX8M ROM-5720 SMARC MODULE FOR NEXT GENERATION MULTIMEDIA APPLICATIONS

Embedded Modules & Design-in Services Advantech, a global leader in the embedded computing market, is pleased to announce ROM-5720, a SMARC 2.0 module powered by the NXP ARM Cortex-A53 i.MX8M processor with excellent graphics performance and low power consumption. The ROM-5720 supports 4Kp60 resolution via HDMI 2.0 and 4Kp60 H.265 decoding with HDR. It features a …

ADVANTECH LAUNCHES NXP I.MX8M ROM-5720 SMARC MODULE FOR NEXT GENERATION MULTIMEDIA APPLICATIONS Read More »

3-Axis Magnetic Field Sensor

Wireless power transfer systems are well on their way to replacing conventional wired charging. Ranging from tiny biomedical implants all the way to wirelessly recharging huge electric vehicles. An integral part of the research on wireless power is minimizing the magnetic field density. The International Commission on Non-Ionizing Radiation Protection (ICNIRP) provides scientific advice and …

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Arduino Based Home Automation Project via Bluetooth

In this project, we will design a simple home automation project using simple components using which different electrical appliances can switched on or off. The project is based on Arduino and we have used Arduino UNO for the project. Description Introduction                Nowadays, people have smartphones with them all …

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THE SEVEN-SEGMENT DISPLAY THAT’S ALSO AN INPUT DEVICE

We’re used to seeing all manner of seven-segment displays, be they mechanical, electronic, or something in between. But what all these displays have in common is that they’re, you know, displays. Using them as inputs would just be crazy talk, right? Perhaps, but we like where [Dave Ehnebuske] is going with “InSlide,” the seven-segment input device. …

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RESEARCHERS EXPAND MICROCHIP CAPABILITY WITH NEW 3D INDUCTOR TECHNOLOGY

Smaller is better when it comes to microchips, researchers said, and by using 3D components on a standardized 2D microchip manufacturing platform, developers can use up to 100 times less chip space. A team of engineers has boosted the performance of its previously developed 3D inductor technology by adding as much as three orders of …

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