Designed for next-gen home hub products requiring advanced audio and multi-mode wireless capabilities, including Wi-Fi, Bluetooth, BLE, and Zigbee.
Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability of the Open-Q™ 212A system on module (“SOM”) and Home Hub Development Kit.
Intrinsyc’s Open-Q™ 212A SOM is a compact (50mm x 46.5mm) pre-certified, production-ready embedded computing module that is ideal for cost-sensitive home hub, home automation, and smart audio devices featuring voice control, AI, and wireless connectivity. It is powered by the Qualcomm® Home Hub 300 Platform based on the Qualcomm® APQ8009 System-on-Chip (“SoC”) and includes an advanced Qualcomm audio and voice optimization solution supporting multi-mic beamforming and noise cancellation as well as Hi-Fi stereo audio playback. The 212A SOM satisfies wireless connectivity needs of home hub/home automation devices with a high throughput, pre-certified, Wi-Fi/BT module, supporting dual-band 802.11ac 2×2 MU-MIMO as well as concurrent Bluetooth with independent Wi-Fi and Bluetooth antenna ports for optimal coexistence performance.
“Intrinsyc’s Open-Q™ 212A SOM brings high performance wireless connectivity and advanced audio capability to a variety of voice-controlled smart home applications,” said Clifford Morton, Vice President, Client Solutions, Intrinsyc. “OEMs can quickly develop products and applications using Intrinsyc’s Linux based development platform and their choice of voice services SDKs available from leading vendors. When development is complete OEMs can immediately go into production with Intrinsyc’s Open-Q™ pre-certified system on module.”
Additional information on the Open-Q 212A SOM is available at:
To help IoT device developers quickly evaluate the 212A SOM and jump-start new product development, Intrinsyc offers a full-featured development platform to support the SOM. The 212A Home Hub Development Kit provides a SOM, carrier board, and power supply; everything needed to start your product development today – the carrier board provides audio peripherals to support voice controlled and smart speaker applications, extensive I/O expansion connectors, Wi-Fi and Bluetooth antennas, and multiple USB ports. To support even more wireless connectivity options, including Zigbee, 802.15.4, and Bluetooth LE 5.0, the Dev Kit will support the Qualcomm® QCA4024 SoC add-on board. This optional accessory board plugs into the Open-Q 212A Dev Kit and features a Qualcomm QCA4024 module along with all supporting connections to the 212A SOM. The QCA4024 board is in the final stages of development and will be available in late June, 2019.
Read more: INTRINSYC ANNOUNCES OPEN-Q™ 212A SOM AND DEVELOPMENT KIT BASED ON THE QUALCOMM® HOME HUB 300 PLATFORM