Summary of SMART WIRELESS LAUNCHES A NEW SOM BASED ON SNAPDRAGON™ 660
SMART Wireless Computing announced the Inforce 6503, a compact LGA compute module based on the Qualcomm Snapdragon 660. The 40×35 mm SoM offers advanced visual computing, enhanced graphics, on-device ML, dual MIPI-CSI support, 4K encode/decode, 2×2 802.11ac Wi‑Fi with DBS, Bluetooth 5.x, haptics, and USB-C with UltraHD display capability. It targets rugged displays, industrial IoT, wearables, portable healthcare, and connected cameras, with optional extended temperature and EMI-shielded SKUs and an available reference carrier board.
Parts used in the Inforce 6503:
- Qualcomm Snapdragon 660 Octacore processor
- 2×2 802.11ac Wi‑Fi with DBS
- Bluetooth 5.x
- Haptics support
- USB-C interface with UltraHD display capability
- Dual MIPI-CSI camera interfaces
- Internal memory (ample for 4K encode/decode)
- LGA package SoM (40mm x 35mm)
- Optional EMI shielding
- Optional extended operating temperature SKU
- Reference carrier board design
SMART Wireless Computing® (part of SMART Global Holdings), a leading provider of Snapdragon™ embedded computing platforms and solutions, today announced a compact compute module in an LGA package, Inforce 6503.
Inforce 6503 enables advanced visual computing, enhanced graphics, and on-device machine learning capabilities featuring the Qualcomm® Snapdragon™ 660 processor.
The Inforce 6503 SoM powered by the Snapdragon 660 Octacore processor brings true-to-life colors and lifelike visuals coupled with AI-enabled user experiences. This computes module combines the heterogeneous computing capabilities of the Snapdragon™ SoCs with 2×2 802.11ac Wi-Fi with DBS, Bluetooth 5.x, haptics, a full-featured USB-C interface with UltraHD display capability and ample internal memory to make it a complete 4K encode/decode systems. With support for dual MIPI-CSI cameras, depth perception use-cases like proximity detection, semantic segmentation, autonomous driving, and facial recognition can be enabled with ease on systems built on these SoMs.
The SoM comes in an ultra-small form factor of 40mm x 35mm in an LGA package and is light-weight. It is a perfect fit for rugged applications that requires sturdy mechanical fitment and a need for low vertical profiles. Target end-uses that can benefit from these capabilities include rugged connected displays, high-end industrial IoT, wearables, portable healthcare with advanced imaging requirements, and connected cameras’ domains. Optional SKUs support extended operating temperature range and EMI shielding for better RF noise protection, while also doubling up as a medium for heat spreading and dissipation to further improve performance. SMART wireless offers a reference carrier board design with this SoM to help create and optimize your products with the shortest turnaround time.
Read more: SMART WIRELESS LAUNCHES A NEW SOM BASED ON SNAPDRAGON™ 660
- What processor does the Inforce 6503 use?
The Inforce 6503 uses the Qualcomm Snapdragon 660 Octacore processor. - Does the module support machine learning on-device?
Yes, the module enables on-device machine learning capabilities. - What wireless connectivity does the Inforce 6503 provide?
It provides 2×2 802.11ac Wi‑Fi with DBS and Bluetooth 5.x. - Can the SoM handle 4K video encoding and decoding?
Yes, it has ample internal memory and supports 4K encode/decode systems. - Does the module support camera inputs?
Yes, it supports dual MIPI-CSI cameras. - Is there support for rugged or low-profile mechanical designs?
Yes, the LGA 40mm x 35mm form factor is ultra-small, light-weight, and fits rugged, low vertical profile applications. - Are there SKUs for extended temperature ranges or EMI protection?
Yes, optional SKUs support extended operating temperature ranges and EMI shielding. - Does SMART Wireless provide development hardware for the SoM?
Yes, SMART Wireless offers a reference carrier board design for this SoM.
