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INFINEON’S NEW 80 V DC DC BUCK LED DRIVER IC OFFERS EXCELLENT DIMMING PERFORMANCE

INFINEON’S NEW 80 V DC-DC BUCK LED DRIVER IC OFFERS EXCELLENT DIMMING PERFORMANCE

Infineon Technologies AG introduces the new LED driver IC ILD8150/E. It features an innovative hybrid dimming mode technology for achieving 0.5 percent of the target current. With its supply voltage range from 8 V DC up to 80 V DC, the driver IC provides a high safety voltage margin for applications operating close to safe extra-low voltage (SELV)

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IBASE RELEASES COM EXPRESS MODULES WITH WIDE RANGE OPERATING TEMPERATURE

IBASE RELEASES COM EXPRESS MODULES WITH WIDE-RANGE OPERATING TEMPERATURE

IBASE Technology Inc. a leading provider of Embedded Motherboard and Computing Systems, introduces its latest COM Express Type 10 (ET875) and Type 6 (ET870) COM Express; Modules based on the Intel® Atom™ processor E3900 series, Intel® Pentium® processor N4200 and Intel® Celeron® processor N3350. Designed for the needs of IoT embedded applications including amusement gaming,

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WORLD’S FIRST MONOLITHICALLY INTEGRATED LINEAR HALL SENSOR FOR ASIL D SYSTEMS

WORLD’S FIRST MONOLITHICALLY INTEGRATED LINEAR HALL SENSOR FOR ASIL D SYSTEMS

Infineon Technologies will launch a monolithically integrated linear Hall sensor which was developed entirely according to the safety standard ISO26262 for automotive applications. With just one device, the XENSIV TLE4999I3 enables the development of fault-tolerant systems that have to meet the highest level of functional safety (ASIL D). These include, for example, electric steering systems, electric throttle

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X FAB SILICON FOUNDRIES TAPES OUT OPEN SOURCE RISC V MCU

X-FAB SILICON FOUNDRIES TAPES-OUT OPEN-SOURCE RISC-V MCU

X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with crowd-sourcing IC platform partner Efabless Corporation, today announced the successful first-silicon availability of the Efabless RISC-V System on Chip (SoC) reference design. This open-source semiconductor project went from design start to tape-out in less than three months using the Efabless design flow based on

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