Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), has introduced a new Single Board Computer (SBC) in a 3.5-inch form factor. The 3.5″-SBC-VR1000 is based on the AMD Ryzen™ Embedded V1000 and R1000 processor series and is optionally available with the SoC V1605B, V1202B, R1606G or R1505G. With superior 4K playback and a fanless, low-power […]
Sochip partners with Allwinner to launch a new V831 development board that showcases an Allwinner V831 IP Camera SoC, the very first to include an AI chip. Allwinner has released quite a number of camera processors in the past, the V3, V316, S3, and many more, but none of them ever came with a built-in
LINUX-POWERED DEVELOPMENT KIT IS THE FIRST TO HAVE AN AI-ENABLED CORTEX-A7 CAMERA SOC Read More »
Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to release the NA591, an advanced 1U rackmount network appliance platform with a maximum of thirty-four LAN ports. This high-performance network appliance system is powered by the Intel® Xeon®
Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is announcing the CEM521, a COM Express Type 6 compact form factor module powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U).
AXIOMTEK’S COM EXPRESS TYPE 6 MODULE WITH ENHANCED GRAPHICS PERFORMANCE – CEM521 Read More »
Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is proud to unveil its eBOX710-521-FL, a fanless embedded system powered by the workstation-grade Intel® Xeon® processor with the Intel® C246 chipset. It is also capable of offering the best quality
Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to announce the eBOX640-521-FL, its new high-performance fanless embedded system powered by the 8th generation Intel® Core™ i7/i5/i3 and Celeron® processor with the Intel® H310 chipset (codename: Coffee Lake).
Avalue Technology Inc., a global industrial PC solution provider and an associate member of the Intel® Internet of Things Solutions Alliance, is unveiling EMX-WHLGP, based on Whiskey Lake U Intel® Core™ and Celeron® Processors. The 8th Gen Intel® Whiskey Lake U Core™ SoC i7/i5/i3 & Celeron® BGA onboard processor, leverage the power efficiency of 14nm microarchitecture to deliver double-digit
NEXCOM has launched Neu-X300, a high performance fanless computer, powered with 8th Generation Intel® Core™ i-series processors. With its 190mm x 200mm x 54.4mm size, the modern-looking Neu-X300 uses a TPM2.0 IC to enhance cyber security. By specifically choosing an i5 or i7 processor, Neu-X300 is further equipped with vPRO remote management capability. And with its versatile I/O interface
NEU-X300 – EDGE COMPUTING SYSTEM POWERED BY 8TH GENERATION INTEL® CORE™ PROCESSOR Read More »
The technology company TQ is expanding its i.MX8 product range with the new embedded module TQMa8MxML based on the i.MX8M Mini and Nano CPU family. It supports all nine CPU derivatives of the two families on the small LGA module and all signal pins are available in every configuration. The i.MX8M Mini and Nano CPUs
NEW TQ MODULE BASED ON ARM® CORTEX®-A53 WITH I.MX8M MINI AND NANO TECHNOLOGY Read More »
Nordic Semiconductor today announces that Tundra Labs, a Green Bay, WI-based technology company, has selected Nordic’s nRF52832 multiprotocol System-on-Chip (SoC) for its ‘TL448K6D-VR module’. The TL448K6D-VR module assists developers to simplify and lower the cost of designing six-degrees-of-freedom (6DoF) tracked devices for Valve’s SteamVR gaming platform. The highly integrated module employs the 3.0 by 3.2mm
