Why another spot welder project? Building a spot welder is one of the (arguably few) cases in which you can build something for a fraction of the price of the commercial version with comparable quality. And even if build-before-buy were not a winning strategy, it is a lot of fun! So I decided to embark […]
Spot Welder 1-2-3 Arduino Firmware Read More »
Vishay VCNL36821S IRED Integrated Proximity Sensor is fully integrated with an infrared emitter, a photodiode for proximity measurement, and a signal processing IC in a single package with a 12-bit ADC. With a range of up to 30cm (12″), this stand-alone component simplifies the use and design-in of proximity sensors as no mechanical barriers are required to
VISHAY VCNL36821S IRED INTEGRATED PROXIMITY SENSOR Read More »
Climate Change, a highly debated high school topic, but do we really care about it? We see politicians, scientists, researchers, philanthropists, conservationists and almost everyone blaming each other for every climate catastrophe occurring today. The real question is what climate change or change are we talking about? CliSensio – Climate Sensing and Insect Infestation Control is
CliSensio – Climate Sensing and Insect Infestation Control Read More »
Allegro Microsystems’ device consists of a linear Hall sensor circuit with a copper conduction path located near the surface of the die. The Allegro ACS711 provides economical and precise solutions for AC or DC current sensing in <100 V audio, communications systems, and white goods. The device consists of a linear Hall sensor circuit with a copper conduction
ACS711 HALL EFFECT LINEAR CURRENT SENSOR Read More »
Synchronous DC/DC Buck Regulators Feature Lower Quiescent Current and Proprietary Light Load Mode to Achieve up to 6% Higher Efficiency in Standby Mode Alpha and Omega Semiconductor (AOS) introduced AOZ6682CI and AOZ6683CI. These devices are high efficiency, simple-to-use synchronous buck regulators. The AOZ6682CI and AOZ6683CI are both available in an ultra-thin, thermally enhanced TSOT23-6 package and deliver 2 A and
ALPHA AND OMEGA SEMICONDUCTOR INTRODUCES 18V 2A, AND 3A EZBUCK Read More »
The STTS22H temperature sensor from STMicroelectronics offers high accuracy with low operating and standby current and flexible operating modes. By Gina Roos @ electronicproducts.com STMicroelectronics has launched its STTS22H temperature sensor with typical temperature-reading accuracy of 0.25°C and low operating and standby current. The device enhances temperature and heat-flow monitoring in asset trackers, shipping-container loggers, HVAC systems, air humidifiers,
TEMPERATURE SENSOR ACCURATE TO 0.25°C Read More »
The ACS772/3 family expands to include through-hole and surface-mount CB package options with enhanced working isolation voltage Allegro MicroSystems, a global leader in power and sensing solutions for motion control and energy efficient systems, today announced significant ease-of-use enhancements to its popular high current fully integrated ACS772/3 current sensor “CB” package family. These industry-leading, automotive grade high
NEW SURFACE-MOUNT FULLY INTEGRATED CURRENT SENSORS Read More »
Modern devices are quickly switching to USB-C power adapters, gradually fading out USB-A, and USB-B adapters. USB’s Power Delivery (USB-PD) protocol enables the supplies to be flexible enough to handle charging (or powering) devices ranging from mobile phones to laptops. There are many high quality 90-100 Watt USB-C power adapters available. But unfortunately, there are many devices that
USB-PD STAND-ALONE ADAPTER BOARD FROM OXPLOT Read More »
Diodes Incorporated has announced the introduction of the AP22913, a 2A single-channel, slew-rate-controlled load switch with true reverse current blocking for high-side load-switching applications. Single-channel high-side load switches provide an effective way of applying or removing power to a load, particularly to removable peripherals powered through a USB port. The AP22913A load switch incorporates true reverse current
NEW LOW-VOLTAGE, HIGH-SIDE LOAD SWITCH Read More »
An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @ eenewseurope.com Developed for the mass production of high-performance chips, the layered packaging technology requires pinpoint accuracy
SAMSUNG UNVEILS 12-LAYER 3D-TSV CHIP PACKAGING TECHNOLOGY Read More »
