Summary of SMARC MODULES MAKE NEW 3.5-INCH BOARDS SCALABLE
congatec introduces the conga-SMC1, a 3.5-inch carrier board featuring an Arm-based SMARC socket optimized for NXP i.MX8 modules. This COTS platform supports 12 processor configurations and includes two MIPI-CSI 2.0 connectors for direct camera integration, enabling 3D vision and AI applications without extra hardware. Designed to reduce development time and costs, it facilitates rapid customization for industrial projects ranging from small lot sizes to autonomous vehicle systems.
Parts used in the conga-SMC1:
- 3.5-inch carrier board
- SMARC socket
- NXP i.MX8 module portfolio
- MIPI-CSI 2.0 connectors
- Precompiled binaries software support
After its successful entry into the 3.5-inch SBC market in the middle of last year, congatec is now introducing a new carrier board in this standardized footprint, which impresses with a socket for Arm based SMARC modules. Its I/Os are optimized for use with congatec’s entire NXP i.MX8 module portfolio and it comes in 12 different processor configurations. Considering that the ARM processor world is traditionally characterized by proprietary designs, this 3.5-inch board design is a step further towards commercial-off-the-shelf (COTS) available standard boards and systems, offering fastest time to market. OEMs can implement them in their system solutions without any hardware development effort, using the large ecosystems of standard form factors. Rapid customization of I/Os is another benefit of such a modular design and most suitable for any small or medium sized project.
Our new modular 3.5-inch carrier board makes Arm designs also increasingly attractive for small industrial lot sizes, which until now have been dominated by x86 technology due to a lack of suitable ARM products. And since customer-specific designs can be implemented faster and more cost-effectively with modular boards, this COTS platform is also an ideal basis for custom designs of NXP i.MX8-based systems,” said Martin Danzer, Director Product Management at congatec.
The new conga-SMC1 3.5-inch board not only features a SMARC socket for scalable processor performance, but is also optimized for MIPI cameras, which can now be connected directly and without any additional hardware. Thanks to two MIPI-CSI 2.0 connectors, it is even possible to develop systems that provide three-dimensional vision and can therefore also be used for situational awareness in autonomous vehicles. Combined with processor-integrated support for artificial intelligence and neural networks, this COTS platform offers everything developers need for smart vision systems. Comprehensive software support with precompiled binaries completes the new COTS offering.
Read more: SMARC MODULES MAKE NEW 3.5-INCH BOARDS SCALABLE
- What is the primary function of the new conga-SMC1 board?
It is a 3.5-inch carrier board designed for Arm-based SMARC modules optimized for NXP i.MX8 processors. - How many processor configurations are available for this board?
The board comes in 12 different processor configurations. - Can I connect cameras directly to this board without additional hardware?
Yes, it features two MIPI-CSI 2.0 connectors that allow direct connection of MIPI cameras. - Does this board support artificial intelligence applications?
Yes, it offers processor-integrated support for artificial intelligence and neural networks. - What type of vision systems can be developed using this platform?
Developers can create systems providing three-dimensional vision for situational awareness in autonomous vehicles. - Is hardware development effort required to use this board?
No, OEMs can implement system solutions without any hardware development effort. - Who is the target audience for this modular design?
It is most suitable for small or medium-sized projects and small industrial lot sizes. - What software support is provided with this offering?
Comprehensive software support including precompiled binaries is included.
