thermal

ADVANTECH LAUNCHES PALM SIZE EMBEDDED SYSTEM EPC U2117

ADVANTECH LAUNCHES PALM SIZE EMBEDDED SYSTEM EPC-U2117

Advantech, a leading embedded computing provider announces its latest fanless embedded system EPC-U2117. The palm-sized system uses the latest Intel® Atom® E3900 processor technology to give a 30% CPU performance enhancement and a 45% graphic performance boost. EPC-U2117 is designed with dual display output, multiple I/O, and wide range 12-24V DC power inputs, which target smart […]

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THERMAL PACKAGED MOSFET TARGETS E BIKE POWER SYSTEMS

THERMAL-PACKAGED MOSFET TARGETS E-BIKE POWER SYSTEMS

Analog and mixed-signal semiconductor company MagnaChip Semiconductor (Cheongju-si, South Korea) has announced the release of a 100-V mid-voltage MOSFET with a new thermal package designed for the fast-growing electric bike (e-bike) market. The MOSFET is housed in a M2PAK-7P package suitable to meet the particular requirements of electric bike (e-bike) systems, which are powered by electric motors

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INCANDESCENT LIGHT BULBS AT THE NANOSCALE

INCANDESCENT LIGHT BULBS AT THE NANOSCALE

Using tiny arrays of carbon nanotubes, a team of researchers at Rice University has designed nanoscale incandescent light source that could be tuned to precisely emit at specific wavelength, based on the materials’ configuration. The so-called nanoscale thermal emitters described in a paper titled “Non‐Hermitian Selective Thermal Emitters using Metal–Semiconductor Hybrid Resonators” published in the journal of

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ADVANTECH LAUNCHES HIGH PERFORMANCE COM EXPRESS SOM 5899

ADVANTECH LAUNCHES HIGH-PERFORMANCE COM EXPRESS SOM-5899

Advantech, a world leader in embedded IoT, is pleased to announce the launch of its high-end SOM-5899 series COM Express Type 6 Module designed with 8th and 9th Gen Intel® Core™ H-series processors. Compared with previous generations, the SOM-5899 is enhanced with six cores for better multithreaded performance in compute-intensive applications. With a dual channel 96GB ECC and non-ECC

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QIANLI LC IRP01 THERMAL VISIBLE MICROSCOPE FOR PCB REPAIR

QIANLI LC-IRP01 THERMAL/VISIBLE MICROSCOPE FOR PCB REPAIR

The QianLi’s 160×120 thermal imaging sensor and 1920×1080 visible sensor combine to make a powerful circuit board repair tool, especially helpful in finding overheating or short-circuit issues. Saelig Co. Inc. has introduced the QianLi LC-IRP01 Thermal Imaging Camera, a diagnostic tool for PCBs which displays heat images to help identify damaged or malfunctioning components or short-circuits. 

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HIGH THERMAL RESOLUTION HIGH FRAME RATE LOW COST THERMAL INSPECTION CAMERA

HIGH THERMAL RESOLUTION, HIGH FRAME RATE, LOW COST THERMAL INSPECTION CAMERA

The Fotric 326 provides high quality radiometric images full of detailed thermal information in a handheld pistol-grip camera for investigative analysis Saelig Company, Inc. (www.saelig.com) has introduced the FOTRIC 326 Thermal Imaging Camera – a rugged, durable, accurate, and portable handheld heat investigation device, designed for a wide range of equipment and infrastructure thermal diagnostic tasks.  The 326

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