Cypress Semiconductor PSoC® 6 BLE Prototyping Board (CY8CPROTO-063-BLE) is a low-cost hardware platform enabling design and debugging of PSoC 6 MCU based applications. The PSoC 6 BLE Prototyping Board provides easy access to all the device I/Os in a breadboard-compatible format, and includes an LED, a push button, and current measuring jumpers. This Board is […]
Cypress Semiconductor PSoC® 6 BLE Prototyping Board Continue Reading
Makers and hobbyists enjoy design environments that can automatically identify and bring up hardware when it is connected to a host computer (for example: Arm mbed & Arduino). For professional engineers, this level of assistance may at first seem unnecessary, but in fact it can significantly improve the evaluation and design process and yield really
Process that modifies semiconductor material atom by atom could enable higher-performance electronics. Researchers from MIT and the University of Colorado have fabricated a 3-D transistor that’s less than half the size of today’s smallest commercial models. To do so, they developed a novel microfabrication technique that modifies semiconductor material atom by atom. The inspiration behind the work was to keep up
ENGINEERS PRODUCE SMALLEST 3-D TRANSISTOR YET Continue Reading
Amorphous silicon-based Thin-film transistors (TFTs) are the foundation of many modern-day technologies, such as smartphones and flat-panel TVs. Still, it comes with a few drawbacks like performance limitations due to limited carrier mobility. Provoking the researchers in search of something better. As a result, Organic thin-film transistors (OTFTs) were developed. OTFTs have solved the problem with carrier mobility to
STMicroelectronics along with the audio company USound has created the first MEMS (Micro ElectroMechnical Systems) micro-loudspeaker based on semiconductors. It’s the smallest loudspeaker in the world, but it can produce a powerful noise. MEMS makes it possible. The speakers are being presented at CES 2018 in Las Vegas. In the audio world, the electromechanical capabilities of MEMS have only been used to
World’s Smallest MEMS Micro-Loudspeaker Saves 80 Percent More Energy Continue Reading
Coping with rapid technological advances and finding efficient energy solutions are the keys for development of power electronics of the future. A new research had been done in North Carolina State University about increasing the efficiency of high-power switches. Silicon Carbide is a compound of silicon and carbon with chemical formula SiC. It is a wide bandgap (WBG) semiconductor,
ams AG, a multinational semiconductor manufacturer and provider of high performance sensors and analog ICs, had announced the AS7221, an integrated white-tunable smart lighting manager that can be controlled through its network connection by means of simple text-based commands. AS7221 is a networking-enabled IoT Smart Lighting Manager with embedded tri-stimulus color sensing for direct CIE color point mapping and control. IoT
Technologic Systems has begun testing its first i.MX6 UL (UltraLite) based board, which is also its first computer-on-module that can work as a single board computer. The footprint of 75 x 55mm TS-4100 module features a microSD slot, onboard eMMC, a micro-USB OTG port with power support, and optional WiFi and Bluetooth. This board offers long-term support and a temperature
Researchers have demonstrated the high-performance potential of an experimental transistor made of a semiconductor called beta gallium oxide, which could bring new ultra-efficient switches for applications such as the power grid, military ships and aircraft. The semiconductor is promising for next-generation “power electronics,” or devices needed to control the flow of electrical energy in circuits.
The Next-Generation Semiconductor for Power Electronics Continue Reading
Swiss scientists have created the first semiconductor laser consisting solely of elements of main group IV (the carbon group) on the periodic table. Simply, this means that the new device is directly compatible with other elements in that group – such as silicon, carbon, and lead – and so can be directly incorporated in a
First germanium-tin semiconductor laser directly compatible with silicon chips Continue Reading
