cpu

XCOM – COMPACT EMBEDDED X86 PLATFORM FOR SDR AND OTHER APPLICATIONS

XCOM – COMPACT, EMBEDDED X86 PLATFORM FOR SDR AND OTHER APPLICATIONS

Designed To Support Unattended Operation, IP65+, And Passive Cooling Have you ever tried designing a truly embedded x86-based system? We have, and it was a journey full of unexpected pitfalls. Consider the importance of unattended operation, including resilience in the face of power failures and power voltage fluctuation. Need support for different CPU models? A […]

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SODIMM STYLE MODULES EXPAND UPON I.MX8M AND I.MX8M MINI

SODIMM-STYLE MODULES EXPAND UPON I.MX8M AND I.MX8M MINI

CPU Module with processor from the i.MX8 series The new Trizeps VIII uses the i.MX 8M processor from the NXP i.MX8 series. The CPU Module provides the high performance demands of current video, voice, and audio processing, either for industrial or home automation, streaming audio applications, or for modern imaging devices. Available with Linux and

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WEBFPGA RAPID FPGA DEVELOPMENT SYSTEM ON THE CLOUD

WEBFPGA: RAPID FPGA DEVELOPMENT SYSTEM ON THE CLOUD

WebUSB programmable FPGA development boards. Cloud-based synthesis. Until recently, FPGA development has suffered from a high barrier to entry for newcomers. In the past, development boards using Xilinx, Lattice, and Altera chipsets easily fetched $250-$2000 price tags. The hardware barrier has been all but eliminated by recent entrants, which include MojoBoard (https://alchitry.com/products/mojo-v3), the IceBreaker (https://www.crowdsupply.com/1bitsquared/icebreaker-fpga),

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SILANNA SEMICONDUCTOR INTRODUCES VERSATILE 12A BUCK CONVERTER FOR ULTRA COMPACT PCB LAYOUT

SILANNA SEMICONDUCTOR INTRODUCES VERSATILE 12A BUCK CONVERTER FOR ULTRA-COMPACT PCB LAYOUT

1 MHz operation and high integration in a compact 3mmx4mm QFN package to deliver the best power density with a minimum external component count. Silanna Semiconductor, an innovative producer of disruptive technologies, today announced its highly integrated SZPL8216A family of synchronous point-of-load (PoL) buck converters. These DC/DC buck converters integrate the functions of the DC/DC constant-on-time (COT)

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INTRINSYC ANNOUNCES IMMEDIATE AVAILABILITY OF THE OPEN Q™ 820PRO HIGH PERFORMANCE SYSTEM ON MODULE

INTRINSYC ANNOUNCES IMMEDIATE AVAILABILITY OF THE OPEN-Q™ 820PRO HIGH-PERFORMANCE SYSTEM ON MODULE

High-performance edge computing module for use in a variety of consumer and industrial IoT Devices Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability of the Open-Q™ 820Pro µSOM (micro System on Module) and Development Kit. Intrinsyc’s Open-Q™ 820Pro

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HIGH PERFORMANCE ARM SOM POWERED BY NXP I.MX 8M

HIGH-PERFORMANCE ARM SOM POWERED BY NXP I.MX 8M

Shenzhen, China – June 11, 2019 – MYIR introduces a high-performance ARM SoM MYC-JX8MX CPU Module, which is built around the NXP i.MX 8M Quad processor featuring 1.3GHz quad ARM Cortex-A53 cores and a real-time ARM Cortex-M4 co-processor. The module runs Linux and is capable of working in extended temperature ranging from -30°C to 80°C. Measuring 82mm by 52mm, the MYC-JX8MX CPU

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AI CORE XP4 AND XP8 THE FLEXIBLE AI SOLUTION WITH INTEL MYRIAD X

AI CORE XP4 AND XP8: THE FLEXIBLE AI SOLUTION WITH INTEL MYRIAD X

AAEON, an award-winning leader of AI edge solutions, announces the latest products in our line of AI modules featuring the Intel Movidius Myriad X, the AI Core XP4 and XP8. The AI Core XP4 and XP8 offer users a scalable solution on a PCIe [x4] form factor for PC-based AI applications and neural network acceleration. While

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LEAKED INTEL ROADMAP REVEALS A 2Q LAUNCH FOR 10NM ICE LAKE CHIPS AND LAKEFIELD PROCESSOR

LEAKED INTEL ROADMAP REVEALS A 2Q LAUNCH FOR 10NM ICE LAKE CHIPS AND LAKEFIELD PROCESSOR

A leaked Intel roadmap reveals launch plans for Intel Core and Atom processors through the end of 2021. Of interest is a hybrid Lakefield processor design that combines a 10nm Ice Lake core and 4x Atom Tremont cores. The roadmap contains several surprises, like Intel’s plans for a market launch of its 10nm U- and Y-series Ice Lake chips, and also its

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