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Kontron Introduces its First Compact Ryzen V1000 Embedded Module

Kontron Introduces its First Compact Ryzen V1000 Embedded Module

Kontron a global provider of IoT/ Embedded computer Technology (ECT) introduces its Linux friendly “COMe-cVR6” Express Type 6 module, that comes with a Ryzen embedded V1000 SoC with up to 24GB DDR4, including 8GB soldered on board. The board also comes with a quad- display support and optional- 40 to 85-degree Celsius operation and security

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Octavo Creates a 1GHz Computer That Fits into A 27x27mm SiP Package

Octavo Creates a 1GHz Computer That Fits into A 27x27mm SiP Package

The OSD335x C-SiP System-in-Package (SiP) developed by Octavo, is a concept package that is modeled on its previous Sitara AM335x based SiP by including up to 16GB eMMC, an oscillator along with 1GB DDR3, PMIC, LDO, and EEPROM. The OSD335x C-SiP, is the most consolidated System-In-Package (SiP) module ever made. Modeled like its predecessors, the

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Variscite Releases Headless Version of Its Linux friendly DART 6UL CoM

Variscite Releases Headless Version of Its Linux-friendly DART-6UL CoM

Variscite is releasing another pin-compatible version of their 50 x 25mm DART-6UL computer-on-module. This time it will be loaded with NXP’s headless new i.MX6 ULZ variant of the single Cortex-A7 core i.MX6 UL. This yet unnamed module lacks display or LAN support. It is described as “a native solution for headless Linux-based embedded products such as IoT devices and smart

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Avalue’s ECM CFS SBC Sports Intel’s Coffee Lake Processor

Avalue’s ECM-CFS SBC Sports Intel’s Coffee Lake Processor

Avalue recently announced a Linux-friendly 3.5″ ECM-CFS Single Board Computer with a choice of Intel’s latest 8th Gen “Coffee Lake” S-series processors. It also features triple display support, 2x GbE, 4x USB 3.1, 2x SATA, and mSATA. This SBC is considered as the world’s first 3.5-inch SBC to feature Intel’s 8th Gen “Coffee Lake” processors. Avalue’s 146

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3D TLC NAND Flash technology enters the Industry

3D TLC NAND Flash technology enters the Industry

3D TLC NAND flash based products are already dominating in SSD for consumers. Sophisticated NAND FLASH manufacturing technology, new advanced FLASH controllers and firmware now allow using 3D TLC NAND in industrial grade SSDs. Apacer introduces a new ST170 series in 2.5″ SSD, M.2, mSATA, MO-297, CFast and uSSD form factors. To make products reliable and

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TS 7553 V2 – IoT Ready SBC with Reliable Storage Cell Modem XBee PoE

TS-7553-V2 – IoT-Ready SBC with Reliable Storage, Cell Modem, XBee, PoE

This versatile embedded single board computer hits on all the main points for a low power, cost effective, Internet-of-Things (IoT) capable, and ready-to-deploy OEM board with an emphasis on data integrity. The TS-7553-V2 offers the ability to communicate seamlessly with several different networks simultaneously from a single device. Using the onboard peripherals the system can

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