Summary of EXTREMELY SMALL POWER-SAVING 3D MAGNETIC SENSOR OPENS UP NEW DESIGN OPTIONS
Infineon unveiled the TLI493D-W2BW, a new member of its XENSIV 3D magnetic sensor family, featuring the latest 3D Hall technology in an extremely small WLB-5 wafer-level package (1.13 mm x 0.93 mm x 0.59 mm). The device reduces footprint by 87% and height by 46% versus predecessors, consumes just 7 nA in power-down mode, and suits space-critical and low-power applications—enabling replacements for resistor-based or optical solutions in BLDC micromotor commutation, joysticks, game consoles, and other industrial and consumer uses.
Parts used in the TLI493D-W2BW Project:
- TLI493D-W2BW 3D magnetic sensor (WLB-5 package)
- WLB-5 wafer-level package (1.13 mm x 0.93 mm x 0.59 mm)
Infineon Technologies AG will expand its XENSIV™ 3D magnetic sensor family TLx493D. At its in-house digital trade show “Virtual Sensor Experience”, the chipmaker will present a new device for industrial and consumer applications: the TLI493D-W2BW.
It uses the latest 3D Hall generation from Infineon and is housed in an extremely small wafer-level package. With an 87 percent smaller footprint and 46 percent less height than previous comparable products, the sensor opens up new design options.
Due to the small WLB-5 package (1.13 mm x 0.93 mm x 0.59 mm) and its low current consumption of 7 nA in power-down mode, the new magnetic sensor is also suitable for use in applications that previously used resistor-based or optical solutions. Magnetic sensors offer numerous advantages here, such as their high accuracy or robustness against dust and moisture. In addition, magnetic sensors are easier to assemble and offer more design options.
In particular, the low height of the TLI493D-W2BW is helpful in extremely space-critical applications such as BLDC commutation in micromotors or control elements such as joysticks or game consoles.
Read more: EXTREMELY SMALL POWER-SAVING 3D MAGNETIC SENSOR OPENS UP NEW DESIGN OPTIONS
- What is the new sensor Infineon announced?
The TLI493D-W2BW 3D magnetic sensor from Infineon's XENSIV family. - What package does the TLI493D-W2BW use?
It uses a WLB-5 wafer-level package sized 1.13 mm x 0.93 mm x 0.59 mm. - How much smaller is the new sensor compared to previous products?
The sensor has an 87 percent smaller footprint and 46 percent less height than comparable earlier products. - What is the power-down current consumption?
The TLI493D-W2BW consumes 7 nA in power-down mode. - Which applications benefit from the sensor's low height?
Space-critical applications such as BLDC commutation in micromotors and control elements like joysticks or game consoles. - Why might designers replace resistor-based or optical solutions with this sensor?
Because magnetic sensors offer high accuracy, robustness against dust and moisture, easier assembly, and more design options. - Where was the device presented?
At Infineon's in-house digital trade show Virtual Sensor Experience.
