DELO has developed a new electronic adhesive that is both thermally conductive and electrically insulating and shows good strength even after standardized humidity tests with subsequent reflow cycles. DELO MONOPOX TC2270 ensures fast heat transfer and long-term reliable operation of semiconductors in power electronics.
A common reason for the failure of power semiconductors is the heat development in the often very small components, as there is usually no efficient heat dissipation. Adhesives not only ensure a permanent bond but also dissipate heat and provide electrical insulation.
The new electronic adhesive from DELO is a one-component, heat-curing epoxy resin. Due to its ceramic filler aluminum nitride it provides very high thermal conductivity of 1.7 W/(m∙K) (measured by the criteria of ASTM D5470). This is comparable with silver-filled isotropic conductive adhesives (ICA), which have a thermal conductivity of ~1.5-2.0 W/(m∙K).
One advantage of DELO MONOPOX TC2270 over ICA is that it also provides electrical insulation. The adhesive thus ensures both reliable heat dissipation and electrical insulation of assemblies. Using the new electronic adhesive additionally allows proportionate component costs to be reduced.
Read more: DELO INTRODUCES A NEW ADHESIVE FOR POWER SEMICONDUCTORS
