Summary of DELO INTRODUCES A NEW ADHESIVE FOR POWER SEMICONDUCTORS
DELO MONOPOX TC2270 is a one-component, heat-curing epoxy electronic adhesive filled with aluminum nitride that provides thermal conductivity of 1.7 W/(m·K) while remaining electrically insulating. It enables fast heat transfer and reliable long-term operation of power semiconductors, maintains strength after humidity tests and reflow cycles, and can reduce component costs compared with silver-filled isotropic conductive adhesives.
Parts used in the DELO MONOPOX TC2270 Project:
- DELO MONOPOX TC2270 (one-component, heat-curing epoxy adhesive)
- Aluminum nitride (ceramic filler)
- Power semiconductors (assemblies to be bonded and cooled)
- Standardized humidity test setup (for qualification)
- Reflow soldering process/equipment (for post-curing cycles)
DELO has developed a new electronic adhesive that is both thermally conductive and electrically insulating and shows good strength even after standardized humidity tests with subsequent reflow cycles. DELO MONOPOX TC2270 ensures fast heat transfer and long-term reliable operation of semiconductors in power electronics.
A common reason for the failure of power semiconductors is the heat development in the often very small components, as there is usually no efficient heat dissipation. Adhesives not only ensure a permanent bond but also dissipate heat and provide electrical insulation.
The new electronic adhesive from DELO is a one-component, heat-curing epoxy resin. Due to its ceramic filler aluminum nitride it provides very high thermal conductivity of 1.7 W/(m∙K) (measured by the criteria of ASTM D5470). This is comparable with silver-filled isotropic conductive adhesives (ICA), which have a thermal conductivity of ~1.5-2.0 W/(m∙K).
One advantage of DELO MONOPOX TC2270 over ICA is that it also provides electrical insulation. The adhesive thus ensures both reliable heat dissipation and electrical insulation of assemblies. Using the new electronic adhesive additionally allows proportionate component costs to be reduced.
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- What type of adhesive is DELO MONOPOX TC2270?
It is a one-component, heat-curing epoxy electronic adhesive. - What filler does the adhesive use to achieve thermal conductivity?
It uses aluminum nitride as a ceramic filler. - What is the thermal conductivity of DELO MONOPOX TC2270?
Its thermal conductivity is 1.7 W/(m·K) measured by ASTM D5470 criteria. - Is DELO MONOPOX TC2270 electrically conductive or insulating?
The adhesive is electrically insulating. - How does its thermal performance compare to silver-filled ICA?
Its thermal conductivity of 1.7 W/(m·K) is comparable to silver-filled ICA which is about 1.5–2.0 W/(m·K). - Does the adhesive maintain strength after humidity tests and reflow cycles?
Yes, it shows good strength even after standardized humidity tests with subsequent reflow cycles. - What benefits does using this adhesive provide for power semiconductor assemblies?
It ensures fast heat transfer, electrical insulation, long-term reliable operation, and can reduce component costs.
