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Samsung launches industrys first 12Gb LPDDR4 DRAM

Samsung launches industry’s first 12Gb LPDDR4 DRAM

The newest LPDDR4 is expected to significantly accelerate the adoption of high capacity mobile DRAM worldwide. The 12Gb LPDDR4 brings the largest capacity and highest speed available for a DRAM chip, while offering excellent energy efficiency, reliability and ease of design – all essential to developing next-generation mobile devices. “By initiating mass production of 12Gb

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Toshiba launches 256 Gbit 48 layer 3 D NAND flash

Toshiba launches 256-Gbit 48-layer 3-D NAND flash

Ready for sampling in September, Toshiba’s 48-layer BiCS (Bit Cost Scalable) flash memory stores 256 Gbits using a 3-D vertically stacked cell structure and 3-bit-per-cell triple-level cell technology. By employing this 48-layer vertical stacking process, BiCS flash surpasses the capacity of conventional 2-D NAND flash memory, where cells are arrayed in a planar direction on

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CAP XX launches 0.6mm Thinline supercapacitors

CAP-XX launches 0.6mm Thinline supercapacitors

Eliminated materials and changed processes to reduce thickness and costs to below $1 Sydney, Australia – May 18, 2015 – CAP-XX (LSE:CPX), developer of flat supercapacitors for burst and back-up power in space-constrained electronic devices, today launched its Thinline series of single-cell supercapacitors. The world’s thinnest at 0.6mm thick, and with prices starting at less

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