A crowdfunding campaign has been launched for a x5-Z8350, 2GB RAM, 16GB flash board called ATOMIC Pi. The IoT board Atomic Pi starts for just $34 plus shipping or $49 with a breakout shield on Kickstarter. The x86 price is on the low side, compared to Aaeon’s $99 UP board or the DFRobot’s $119 LattePanda […]
Intel Atomic Pi SBC Launches for $34 Read More »
Cirrus7 has launched an “AI-Box TX2” mini-PC with a Jetson TX2 module with -20 to 70°C extended temperature support. Cirrus7 also offers four Kaby Lake-based mini-PCs and a new Gemini Lake model. The AI-Box TX2 has a similar build like its earlier 7th Gen Kaby Lake-based mini-PCs, but it is the smallest of all with
Cirrus7 Launches AI-Box TX2 and four Kaby Lake-based mini-PCs Read More »
Qualcomm announced back in April its QCS605 SoC, calling it “the first 10nm FinFET fabricated SoC, built for the Internet of Things.” The octa-core Arm SoC is available in an Intrinsyc Open-Q 605 SBC with full development kit, including a 12V power supply which is available for pre-order at $429. The product will ship in
Qualcomm Launches 10nm, octa-core QCS605 IoT SoC Read More »
RISC architecture is gonna change everything, and I still can’t tell if we like that movie ironically or not. Nevertheless, RISC-V chips are coming onto the market, chipmakers seem really interested in not paying licensing fees, and new hard drives are shipping with RISC-V cores. The latest development in Open instruction sets chips comes from
OPENISA LAUNCHES FREE RISC-V VEGABOARD Read More »
The newest LPDDR4 is expected to significantly accelerate the adoption of high capacity mobile DRAM worldwide. The 12Gb LPDDR4 brings the largest capacity and highest speed available for a DRAM chip, while offering excellent energy efficiency, reliability and ease of design – all essential to developing next-generation mobile devices. “By initiating mass production of 12Gb
Samsung launches industry’s first 12Gb LPDDR4 DRAM Read More »
Ready for sampling in September, Toshiba’s 48-layer BiCS (Bit Cost Scalable) flash memory stores 256 Gbits using a 3-D vertically stacked cell structure and 3-bit-per-cell triple-level cell technology. By employing this 48-layer vertical stacking process, BiCS flash surpasses the capacity of conventional 2-D NAND flash memory, where cells are arrayed in a planar direction on
Toshiba launches 256-Gbit 48-layer 3-D NAND flash Read More »
Eliminated materials and changed processes to reduce thickness and costs to below $1 Sydney, Australia – May 18, 2015 – CAP-XX (LSE:CPX), developer of flat supercapacitors for burst and back-up power in space-constrained electronic devices, today launched its Thinline series of single-cell supercapacitors. The world’s thinnest at 0.6mm thick, and with prices starting at less
CAP-XX launches 0.6mm Thinline supercapacitors Read More »
