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GANYMEDE MEMS SPEAKERS CAN BE RETROFITTED INTO STANDARD ENCLOSURES

GANYMEDE MEMS SPEAKERS CAN BE RETROFITTED INTO STANDARD ENCLOSURES

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USound GmbH’s Ganymede Achelous and Adap MEMS speakers with their compact size of 4.7 mm x 6.7 mm x 1.6 mm are ideal for in-ear headphone designs and wearables such as true-wireless headsets. The perfect addition to traditional speakers, they can be easily retrofitted into standard enclosures to improve treble or implement 3D audio systems. Achelous is […]

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LG AND INFINEON TO INTRODUCE LG G8THINQ WITH FRONT FACING TIME OF FLIGHT CAMERA

LG AND INFINEON TO INTRODUCE LG G8THINQ WITH FRONT-FACING TIME-OF-FLIGHT CAMERA

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With Infineon’s REAL3™ Image Sensor Chip, LG Offers Enhanced Security and Depth Measuring Selfie Camera LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3™ image sensor chip will play a key role in the front-facing camera of the upcoming LG G8 ThinQ, to be unveiled

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TDK CLAIMS SMALLEST POINT OF LOAD DC DC CONVERTER

TDK CLAIMS SMALLEST POINT-OF-LOAD DC-DC CONVERTER

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µPOL DC-DC converters bring highest power density to space-constrained apps TDK Corporation announces the new series of µPOL™ DC-DC converters, the industry’s most compact and highest power density point-of-load solutions for applications such as big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise. Rather than using side by side discrete integrated circuit

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NITROGEN8M MINI IS THE FIRST SBC WITH I.MX8M MINI SOC

NITROGEN8M MINI IS THE FIRST SBC WITH I.MX8M MINI SOC

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Boundary Devices has unveiled its “Nitrogen8M-Mini” SBC, the first SBC that is based on NXP’s new i.MX8M Mini SoC, and also the second embedded board with the first being Variscite’s DART-MX8M-Mini module. The SBC runs Linux on an up to 2GHz, quad -A53 i.MX8M Mini, and offers 2GB RAM, up to 128GB eMMC, PCIe, MIPI CSI/DSI, GbE, and optional

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REAL3™ TIME OF FLIGHT IMAGE SENSOR FOURTH GENERATION WITH HVGA RESOLUTION

REAL3™ TIME-OF-FLIGHT IMAGE SENSOR: FOURTH GENERATION WITH HVGA RESOLUTION

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Infineon Technologies AG is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses. The wide range of use cases includes secure

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VARISCITE REVEALS AN EXTENDED PORTFOLIO OF NEW I.MX BASED BOARDS

VARISCITE REVEALS AN EXTENDED PORTFOLIO OF NEW I.MX BASED BOARDS

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Variscite reveals the portfolio of its new i.MX based products that will be presented next week at the Embedded World 2019 exhibition & conference. Variscite is the only NXP partner who was granted early access to all i.MX 8 programs and will present next week a respectable number of new System-on-Modules based on i.MX 8M Mini, i.MX 8QM and i.MX 8X as

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Cupola360 – World’s most Advanced Spherical Image Processor for 360 degree Cameras

Cupola360 – World’s most Advanced Spherical Image Processor for 360-degree Cameras

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Capitalizing on the global trend of 360-degree imaging, ASPEED Technology Inc., the world’s largest BMC (Baseboard Management Controller) SoC provider, is pleased to announce at MWC19 Barcelona the Cupola360 solutions, world’s advanced Spherical Image Processor specifically designed for 360-degree Camera, as well as the accompanying apps, which cemented the company as the pioneer and leader

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IMEC INVENTED UNIQUE COST EFFECTIVE COOLING FOR HIGH PERFORMANCE CHIPS

IMEC INVENTED UNIQUE COST-EFFECTIVE COOLING FOR HIGH-PERFORMANCE CHIPS

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Imec, the distinguished Belgian research center has invented a new and cost-effective method of cooling chips. This achievement can be an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems. Present powerful electronic systems have high cooling demands for integrated semiconductor chips. Conventional solutions operate with various passive (or occasionally active)

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