Summary of 3D SENSING EMITTER MODULE FOR SMARTER TOF
Osram’s new Bidos PLPVDC 940_P_L01 is an integrated 3D sensing emitter module for Time-of-Flight (ToF) applications that combines a 3 W infrared VCSEL (940 nm), optics, a photodiode and an intelligent microcontroller in a compact 3.6 × 5.46 mm black package. It enables depth capture up to seven meters for staggered depth-of-field imaging, 3D object recognition and augmented reality, and includes safety mechanisms that cut VCSEL power if the photodiode detects abnormal light or if the optics are damaged.
Parts used in the Bidos PLPVDC 940_P_L01:
- Black package
- 3-Watt infrared VCSEL (940 nm)
- Matching optical system
- Integrated intelligent microcontroller for driving the VCSEL
- Photodiode
Osram’s first intelligent emitter module for 3D sensing allows smartphones to take high-quality images and videos with a staggered depth of field. In portrait shots, the person’s face remains in focus, while the background becomes blurred.
Besides optimizing image content, the module can also be used for 3D object recognition or augmented reality apps.
A central task for manufacturers of smartphones and tablets is to find the right emitters, photodiodes and VCSEL driver chips (ICs), then calibrate them and finally install them in the end device. With the VCSEL-based module Bidos PLPVDC 940_P_L01 specifically designed for Time-of-Flight-(ToF) applications, Osram now eliminates a large part of these tasks for manufacturers. The module features a black package, a 3-Watt infrared VCSEL with a wavelength of 940 nanometers (nm), a matching optical system, an integrated intelligent microcontroller for driving the VCSEL and a photodiode. Together, the individual components have a 3.6×5.46mm footprint. The unit’s high optical power enables the acquisition of depth information by ToF at a distance of up to seven meters. Special safety mechanisms are integrated in the module. If the photodiode registers a change in the incidence of light, if the optics are damaged after a fall, the current supply to the VCSEL is interrupted.
Read more: 3D SENSING EMITTER MODULE FOR SMARTER TOF
- What is the Bidos PLPVDC 940_P_L01 used for?
It is used for Time-of-Flight 3D sensing to enable staggered depth-of-field imaging, 3D object recognition, and augmented reality apps. - What components are integrated in the module?
The module integrates a 3 W infrared VCSEL (940 nm), a matching optical system, an intelligent microcontroller, and a photodiode in a black package. - What is the module footprint?
The combined components have a 3.6 × 5.46 mm footprint. - How far can the module acquire depth information?
The unit can acquire depth information by ToF at distances of up to seven meters. - What safety mechanisms are included?
The module interrupts the VCSEL current supply if the photodiode detects a change in incident light or if the optics are damaged after a fall. - What advantage does the module provide to smartphone manufacturers?
It eliminates much of the task of selecting emitters, photodiodes and VCSEL driver ICs, calibrating them, and installing them in the end device. - What wavelength does the VCSEL use?
The VCSEL operates at a wavelength of 940 nanometers.
