technology

New 24.06 efficiency record for bifacial silicon solar cell

New 24.06% efficiency record for bifacial silicon solar cell

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LONGi Solar has announced that it has achieved a new monocrystalline silicon PERC (Passivated Emitter Rear Cell) world record conversion efficiency using commercial wafer (M2) dimensions that exceeds 24 percent for the first time, according to tests carried out by the National Center of Supervision and Inspection on Solar Photovoltaic Product Quality (CPVT) in China. […]

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FORLINX OK5718 C COMES WITH PRU TECHNOLOGY

FORLINX OK5718-C COMES WITH PRU TECHNOLOGY

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Ever since its foundation in 2007, Forlinx Embedded Tech. Co., Ltd. has been a major manufacturer and distributor of ARM technology-based embedded products such as Single Board Computers (SBCs), development boards, and many more to major companies all over the world such as Samsung, TI, Freescale, etc. Some of their SBCs are TI (Texas Instruments) Sitara

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Researchers Develop New Technique To Print Flexible Self healing Circuits For Wearable Devices

Researchers Develop New Technique To Print Flexible Self-healing Circuits For Wearable Devices

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The researchers of North Carolina State University in the US, lead by Jingyan Dong, have developed a new technique for directly printing flexible, stretchable metal circuits. The innovative technique can be used with multiple metals and alloys. It is also compatible with existing manufacturing systems which can integrate this new printing technology effortlessly. The technique uses the well known electrohydrodynamic printing

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Nanobots Fight Cancerous Cells

Nanobots Fight Cancerous Cells

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Researchers from Polytechnique Montréal, Université de Montréal and McGill University have just achieved a spectacular breakthrough in cancer research. They have developed new nanorobotic agents capable of navigating through the bloodstream to administer a drug with precision. Professor Sylvain Martel is holder of the Canada Research Chair in Medical Nanorobotics and the Director of the

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A MINIATURE MICROFLUIDICS HEAT SINK FOR HIGH PERFORMANCE CHIP COOLING

A MINIATURE MICROFLUIDICS HEAT SINK FOR HIGH-PERFORMANCE CHIP COOL

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At the Embedded World Conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a silicon-based compact microchannel heat sink that enables high heat flux dissipation. The imec heat sink assembled to a high performance chip for cooling the latter one achieves a low total thermal resistance of 0,34K/W to 0.28K/W at

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OurPCB Published Rigid Flexible Circuit – The Ultimate Guide to the Most Effective PCB 1

‘Rigid Flexible Circuit – the Most Effective PCB.’

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In this guide, we will introduce the basics, layout, problems and solutions of rigid-flex circuit boards. It has six chapters that cover every detail about Rigid Flexible Circuit. Among the key subjects on Rigid Flexible Circuit include: What is a Rigid-Flex PCB?: This section provides a brief overview of the definition, state, and characteristics of

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Global Solderless Breadboards Market Opportunity Analysis And Industry Forecast 2019 2024

Global Solderless Breadboards Market Opportunity Analysis And Industry Forecast 2019-2024

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Global Solderless Breadboards Market report studies recognize outline for always-changing aggressive dynamics about the growth factors that control or drive the business growth. The Solderless Breadboards Industry report is related to understand the market situations and opportunities where it has a scope to grow Inside the future. It is a known and detailed report focusing

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Renesas Electronics Achieves Lowest Embedded SRAM Power of 13.7 nW Mbit

Renesas Electronics Achieves Lowest Embedded SRAM Power of 13.7 nW/Mbit

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Renesas Electronics Corporation announced the successful development of a new low-power SRAM circuit technology that achieves a record ultra-low power consumption of 13.7 nW/Mbit in standby mode. The prototype SRAM also achieves a high-speed readout time of 1.8 ns during active operation. Renesas Electronics applied its 65nm node silicon on thin buried oxide (SOTB) process to develop this

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