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SAMSUNG UNVEILS 12 LAYER 3D TSV CHIP PACKAGING TECHNOLOGY

SAMSUNG UNVEILS 12-LAYER 3D-TSV CHIP PACKAGING TECHNOLOGY

Electronics News Updates /

An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @ eenewseurope.com Developed for the mass production of high-performance chips, the layered packaging technology requires pinpoint accuracy […]

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SAMSUNG DEVELOPS INDUSTRY’S FIRST 3RD GENERATION 10NM CLASS DRAM

SAMSUNG DEVELOPS INDUSTRY’S FIRST 3RD-GENERATION 10NM-CLASS DRAM

Electronics News Updates /

New 8Gb DDR4 Based On Most Advanced 1z-Nm Process Enables DRAM Solutions With Ultra-High Performance And Power Efficiency. Samsung Electronics, the world leader in advanced memory technology, today announced that it has developed a 3rd-generation 10-nanometer-class (1z-nm) eight-gigabit (Gb) Double Data Rate 4 (DDR4) DRAM for the first time in the industry. In just 16 months since it began

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Samsung Breaks Terabyte Threshold for Smartphone Storage with eUFS

Samsung Breaks Terabyte Threshold for Smartphone Storage with eUFS

Electronics News Updates /

Powered by the company’s fifth-generation V-NAND, the new Universal Flash Storage offers 20x more storage than a 64GB internal memory and 10x the speed of a typical microSD card for data-intensive applications. Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first one-terabyte (TB) embedded

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Samsung launches industrys first 12Gb LPDDR4 DRAM

Samsung launches industry’s first 12Gb LPDDR4 DRAM

Electronics News Updates /

The newest LPDDR4 is expected to significantly accelerate the adoption of high capacity mobile DRAM worldwide. The 12Gb LPDDR4 brings the largest capacity and highest speed available for a DRAM chip, while offering excellent energy efficiency, reliability and ease of design – all essential to developing next-generation mobile devices. “By initiating mass production of 12Gb

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Samsung Announces Their Entry into the Arduino Family

Samsung Announces Their Entry into the Arduino Family

Electronics News Updates /

When you think about Samsung, the first products that come to mind are probably phones or televisions, not Maker-focused electronics. Today, with their announcement at Internet of Things World, Samsung has entered the Maker world with their ARTIK platform, an Arduino compatible family of devices targeted towards Internet of Things applications. Currently there are three

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