Nano-sandwiches in Electronics Significantly Reduce Risk of Overheating

A new study about “Reduction of overheating of 2D materials” published in the Journal of Advanced Materials. The work put behind the study is credited to the researchers at the University of Illinois at Chicago College of Engineering. By joining together two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases, they formed an ultrathin layer of Aluminium Oxide w ...

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