memory

EXCELON™ FERROELECTRIC-RAM (F-RAM™)

Cypress Semiconductor’s F-RAM is ideal for portable medical, wearable, IoT sensor, industrial, and automotive applications Cypress Semiconductor’s Excelon is next-generation Ferroelectric RAM (F-RAM) which delivers the industry’s lowest-power mission-critical nonvolatile memory by combining ultra-low-power operation with high-speed interfaces, instant nonvolatility, and unlimited read/write cycle endurance. This makes Excelon the ideal data-logging memory for portable medical, wearable, …

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WESTERN DIGITAL INAND IX EM132

iNand IX EM132 – Industrial Embedded Flash Device. The Industrial iNAND IX EM132 Embedded Flash Drive (EFD) is Western Digital’s most advanced e.MMC flash storage solution for industrial applications, with high reliability and endurance across a wide range of operational requirements. Designed and tested to withstand demanding environmental conditions, this industrial- grade flash device features advanced …

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AVNET INTEGRATED ANNOUNCES NEW SIMPLEFLEX PLATFORM

Avnet Integrated announces its second SimpleFlex platform which is well-suited for HMI and IoT applications, and can be quickly adapted to a wide range of other applications with only minor configuration modifications. The ready-to-use SimpleFlex platform MSC SM2S-MB-EP5 is designed for use with Avnet Integrated’s broad portfolio of x86- and ARM-based SMARC 2.0™ modules which encompasses the entire …

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AXIOMTEK’S EBOX100-51R-FL – A FANLESS ULTRA COMPACT EMBEDDED SYSTEM FOR EDGE COMPUTING

Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is proud to unveil eBOX100-51R-FL, a fanless ultra-compact embedded system with weight 600 grams only. As the smallest embedded system with Intel® Core™ ULT processor onboard, the eBOX100-51R-FL continues the …

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FUJITSU SEMICONDUCTOR RELEASES WORLD’S LARGEST DENSITY 8MBIT RERAM PRODUCT FROM SEPTEMBER

Featuring memory with the industry’s smallest read current, optimal for small wearable devices Fujitsu Semiconductor announced the release of the 8 Mbit ReRAM MB85AS8MT, which has the world’s largest density as a mass-produced ReRAM product, available from September 2019. This ReRAM product was jointly developed with Panasonic Semiconductor Solutions Co.. The MB85AS8MT is an EEPROM-compatible non-volatile memory with SPI-interface that operates with …

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AI COMPUTE ACCELERATION STARTUP BUILDS THE LARGEST CHIP EVER FOR DEEP LEARNING APPLICATIONS

To meet the ever-increasing computational demands of AI, California based AI startup, Cerebras Systems, just recently unveiled its very first announced element claimed to be the most massive AI chip ever made. With an astounding measurement of 46,225 mm2 (up to 56.7 times more than the largest graphics processing unit) and more than 1.2 trillion transistors, the Wafer-Scale Engine …

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ASDM-S-KBU: BRING THE EDGE TO SMART DISPLAY SOLUTIONS

AAEON, an industry leader in embedded solutions, announces the ASDM-S-KBU, the only Intel SDM Small (SDM-S) module featuring 7th Generation Intel Core processors (formerly Kaby Lake). The ASDM-S-KBU offers unparalleled computing power for its compact size, capable of powering AI Edge applications. The ASDM-S-KBU brings the high performance of Intel Core processors to the compact Intel …

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INTRINSYC ANNOUNCES IMMEDIATE AVAILABILITY OF THE OPEN-Q™ 820PRO HIGH-PERFORMANCE SYSTEM ON MODULE

High-performance edge computing module for use in a variety of consumer and industrial IoT Devices Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability of the Open-Q™ 820Pro µSOM (micro System on Module) and Development Kit. Intrinsyc’s Open-Q™ 820Pro …

INTRINSYC ANNOUNCES IMMEDIATE AVAILABILITY OF THE OPEN-Q™ 820PRO HIGH-PERFORMANCE SYSTEM ON MODULE Read More »

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