At the Embedded World Conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a silicon-based compact microchannel heat sink that enables high heat flux dissipation. The imec heat sink assembled to a high performance chip for cooling the latter one achieves a low total thermal resistance of 0,34K/W to 0.28K/W at less than 2 W pump power. The a ...

One of the limiting factors for the computing power of processors is the operating temperature. A research team led by Dr. Wolfram Steller, Dr. Hermann Oppermann, and Dr. Jessika Kleff from the Fraunhofer Institute for Reliability and Microintegration IZM, has developed a new as well as an efficient cooling method by integrating microchannels into the silicon interposer. For the first time, it is possible t ...