MEMS-BASED “SONAR ON A SILICON CHIP” ULTRASONIC TIME-OF-FLIGHT SENSORS
TDK Corporation’s announces the immediate worldwide availability of the Chirp CH-101 MEMS-based ultrasonic Time-of-Flight (ToF) sensor. This ToF sensor utilizes a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the sensor’s field-of-view. By calculating the ToF, the sensor can determine the location of […]
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