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HARTING EUROPE, COMPONENT CARRIER NOW REPLACING FLEXIBLE PCBS

Summary of HARTING EUROPE, COMPONENT CARRIER NOW REPLACING FLEXIBLE PCBS


Flexible circuit boards offer flexibility but pose complex mechanical fixation challenges. HARTING introduces a 3D-MID based component carrier that replaces flexible PCBs, allowing direct component mounting to reduce assembly complexity and cut costs by up to two-thirds. These carriers integrate between PCBs and components like LEDs or sensors, are delivered in tape & reel for automated systems, and support standard SOIC-8 sizes or custom dimensions.

Parts used in the Component Carrier Project:

  • 3D-MID technology
  • Injection molded part
  • Customized layout
  • Electronic components (LEDs, ICs, photodiodes, sensors)
  • Printed circuit board (PCB)
  • Tape & reel packaging
  • Standard size SOIC-8 components
  • Automatic assembly systems

Flexible circuit boards offer numerous advantages. However, the mechanical fixation of these circuit boards is highly complex. HARTING has developed a new solution based on 3D-MID technology that is capable of replacing flexible circuit boards. Thanks to component carriers, cost savings of up to two-thirds can be achieved.

HARTING EUROPE, COMPONENT CARRIER NOW REPLACING FLEXIBLE PCBS

At the MID process, on the injection molded part a customized layout is applied. At the electronic assembly, the components are mounted on the desired surface.

Flexible printed circuit boards made of thin polyimide films have established themselves in many product areas thanks to their application flexibility. Populating and assembling them, however, is decidedly more complex. This is where a newly developed component carrier from HARTING enters the picture.

A standardized component carrier for electronic components

By harnessing this all new HARTING development, electronic components can be fitted directly onto the component carrier, thereby replacing flexible circuit boards. The component carrier serves as a connecting element between the printed circuit board (PCB) and electronic components such as LEDs, ICs, photodiodes and sensors.

Electronic components are mounted directly on the new component carrier in automated processes. The frequently complex processes involved in processing flexible circuit boards is dispensed with, thereby reducing costs by up to two-thirds.

The populated component carriers are delivered in tape & reel. In their standard design, the carriers can be processed in automatic assembly systems, just like other SMD electronic components. Two different sizes are currently available and can accommodate electronic components of standard size SOIC-8 and smaller. Moreover, HARTING can also produce the carriers in customer-specific sizes.

Read more: HARTING EUROPE, COMPONENT CARRIER NOW REPLACING FLEXIBLE PCBS

Quick Solutions to Questions related to Component Carrier Project:

  • How does the new solution replace flexible circuit boards?
    The new HARTING component carrier allows electronic components to be fitted directly onto it, eliminating the need for flexible printed circuit boards.
  • What cost savings can be achieved with this technology?
    Cost savings of up to two-thirds can be achieved by dispensing with the frequently complex processes involved in processing flexible circuit boards.
  • Which electronic components can be mounted on the carrier?
    The carrier serves as a connecting element for LEDs, ICs, photodiodes, and sensors.
  • How are the populated component carriers delivered?
    The populated component carriers are delivered in tape & reel format.
  • Can these carriers be processed in automatic assembly systems?
    Yes, in their standard design, the carriers can be processed in automatic assembly systems just like other SMD electronic components.
  • What component sizes do the standard carriers accommodate?
    The standard designs can accommodate electronic components of standard size SOIC-8 and smaller.
  • Is customization available for the component carriers?
    Yes, HARTING can produce the carriers in customer-specific sizes beyond the standard options.
  • What technology is used to apply the customized layout?
    The MID process applies a customized layout on the injection molded part.

About The Author

Ibrar Ayyub

I am an experienced technical writer holding a Master's degree in computer science from BZU Multan, Pakistan University. With a background spanning various industries, particularly in home automation and engineering, I have honed my skills in crafting clear and concise content. Proficient in leveraging infographics and diagrams, I strive to simplify complex concepts for readers. My strength lies in thorough research and presenting information in a structured and logical format.

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