technology

Researchers Develop New Technique To Print Flexible Self healing Circuits For Wearable Devices

Researchers Develop New Technique To Print Flexible Self-healing Circuits For Wearable Devices

The researchers of North Carolina State University in the US, lead by Jingyan Dong, have developed a new technique for directly printing flexible, stretchable metal circuits. The innovative technique can be used with multiple metals and alloys. It is also compatible with existing manufacturing systems which can integrate this new printing technology effortlessly. The technique uses the well known electrohydrodynamic printing […]

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Nanobots Fight Cancerous Cells

Nanobots Fight Cancerous Cells

Researchers from Polytechnique Montréal, Université de Montréal and McGill University have just achieved a spectacular breakthrough in cancer research. They have developed new nanorobotic agents capable of navigating through the bloodstream to administer a drug with precision. Professor Sylvain Martel is holder of the Canada Research Chair in Medical Nanorobotics and the Director of the

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Computing and ICT students go from strength to strength at BISP

Computing and ICT students go from strength to strength at BISP

The 2018-2019 academic year has been another action-packed rollercoaster of innova­tive learning within the Com­puting & ICT department at British International School, Phuket – BISP. Key Stage 3 students have been busy exploring the world of robot­ics, competing in Lego Mindstorms challenges, as well as developing their skills in the Python and Arduino C++ programming

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A MINIATURE MICROFLUIDICS HEAT SINK FOR HIGH PERFORMANCE CHIP COOLING

A MINIATURE MICROFLUIDICS HEAT SINK FOR HIGH-PERFORMANCE CHIP COOL

At the Embedded World Conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a silicon-based compact microchannel heat sink that enables high heat flux dissipation. The imec heat sink assembled to a high performance chip for cooling the latter one achieves a low total thermal resistance of 0,34K/W to 0.28K/W at

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Global Solderless Breadboards Market Opportunity Analysis And Industry Forecast 2019 2024

Global Solderless Breadboards Market Opportunity Analysis And Industry Forecast 2019-2024

Global Solderless Breadboards Market report studies recognize outline for always-changing aggressive dynamics about the growth factors that control or drive the business growth. The Solderless Breadboards Industry report is related to understand the market situations and opportunities where it has a scope to grow Inside the future. It is a known and detailed report focusing

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Renesas Electronics Achieves Lowest Embedded SRAM Power of 13.7 nW Mbit

Renesas Electronics Achieves Lowest Embedded SRAM Power of 13.7 nW/Mbit

Renesas Electronics Corporation announced the successful development of a new low-power SRAM circuit technology that achieves a record ultra-low power consumption of 13.7 nW/Mbit in standby mode. The prototype SRAM also achieves a high-speed readout time of 1.8 ns during active operation. Renesas Electronics applied its 65nm node silicon on thin buried oxide (SOTB) process to develop this

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Prosthetics Feeling Is Now Possible With This Implantable Chip By Imec

Prosthetics Feeling Is Now Possible With This Implantable Chip By Imec

Imec, the world-leading research and innovation hub in nano-electronics and digital technology, announced last month its prototype implantable chip that aims to give patients more intuitive control over their arm prosthetics. The thin-silicon chip is said to be world’s first for electrode density. Creating a closed-loop system for future-generation haptic prosthetics technology is the aim

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