A MINIATURE MICROFLUIDICS HEAT SINK FOR HIGH-PERFORMANCE CHIP COOL

At the Embedded World Conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents a silicon-based compact microchannel heat sink that enables high heat flux dissipation. The imec heat sink assembled to a high performance chip for cooling the latter one achieves a low total thermal resistance of 0,34K/W to 0.28K/W at …

A MINIATURE MICROFLUIDICS HEAT SINK FOR HIGH-PERFORMANCE CHIP COOL Read More »