devices

THE SEVEN SEGMENT DISPLAY THATS ALSO AN INPUT DEVICE

THE SEVEN-SEGMENT DISPLAY THAT’S ALSO AN INPUT DEVICE

We’re used to seeing all manner of seven-segment displays, be they mechanical, electronic, or something in between. But what all these displays have in common is that they’re, you know, displays. Using them as inputs would just be crazy talk, right? Perhaps, but we like where [Dave Ehnebuske] is going with “InSlide,” the seven-segment input device. […]

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RESEARCHERS EXPAND MICROCHIP CAPABILITY WITH NEW 3D INDUCTOR TECHNOLOGY

RESEARCHERS EXPAND MICROCHIP CAPABILITY WITH NEW 3D INDUCTOR TECHNOLOGY

Smaller is better when it comes to microchips, researchers said, and by using 3D components on a standardized 2D microchip manufacturing platform, developers can use up to 100 times less chip space. A team of engineers has boosted the performance of its previously developed 3D inductor technology by adding as much as three orders of

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Disposing IED using Non Newtonian Fluid

Disposing IED using Non Newtonian Fluid

Thousands of lives are being lost every year due to IEDs (improvise explosive devices). IEDs were responsible for approximately 63% of coalition deaths in Iraq. ABSTRACT             Mobile Explosive Containment Vessels (MECV) referred to as Total Containment Vessels (TCV) are fully enclosed vessels used to absorb the explosion forces the enclosure is spherical and made of

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NEXCOM NDIS V1000 THE 4K DIGITAL SIGNAGE PLAYER

NEXCOM NDIS V1000: THE 4K DIGITAL SIGNAGE PLAYER

Vibrant, 4k resolution multi-displays come to life with NEXCOM’s new NDiS V1000 digital signage player. Powered by AMD’s APU microprocessor, the seamlessly integrated CPU and GPU result in a high performance yet lower-power device perfect for retail environments – and even private use. The value-added and scalable NDiS V1000’s compact design is the result of customer feedback, with

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3D IMAGE SENSOR REAL3 FOR FACE AUTHENTICATION ANNOUNCED AT CES 2020

3D IMAGE SENSOR REAL3 FOR FACE AUTHENTICATION ANNOUNCED AT CES 2020

Infineon Technologies AG has collaborated with software and 3D Time-of-Flight (ToF) system specialist pmdtechnologies ag to develop reportedly the world’s smallest, most powerful 3D image sensor. Designated the REAL3, the single-chip solution measures just 4.4 x 5.1 mm and is the fifth generation of time-of-flight deep sensors from Infineon. The sensor can be incorporated into even the smallest devices with just

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COM WHUC6 INDUSTRIAL POWER ON MODULE FROM AAEON

COM-WHUC6: INDUSTRIAL POWER ON MODULE FROM AAEON

AAEON, an industry leader in embedded computing, announces the COM-WHUC6 COM Express module. Built to the Compact Type 6 form factor, the COM-WHUC6 is designed to operate in a range of applications from automation to mobile operations. The COM-WHUC6 is powered by the 8th Generation Intel® Core™ i7/i5/i3 and Celeron® ULT series processors (formerly Whiskey Lake), providing energy efficient

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