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AMD LAUNCHES OPEN ECOSYSTEM FOR RYZEN EMBEDDED MINI PCS

AMD LAUNCHES OPEN ECOSYSTEM FOR RYZEN EMBEDDED MINI- PCS

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AMD launched a Ryzen Embedded “open ecosystem” for mini-PCs from multiple vendors, which runs on its Ryzen Embedded V1000 and the newer Ryzen Embedded R1000 system-on-chips. The new line of hardware includes two new Linux enabled mini-PCs from OnLogic, the R1000-based ML100G-40, and V1000-based MC510-40. The systems highlighted in the Ryzen Embedded mini-PC ecosystem are aimed at rugged industrial applications, in exception of ASRock mini-PCs on AMD’s list, which […]

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ECONODUAL™ 3 WITH TRENCHSTOP™ IGBT7 FOR AN UNMATCHED 900 A POWER RATING

ECONODUAL™ 3 WITH TRENCHSTOP™ IGBT7 FOR AN UNMATCHED 900 A POWER RATING

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Infineon Technologies AG introduced the new IGBT7 chip for its well-known Easy housing platform in March. Now it is taking the state-of-the-art TRENCHSTOP™ IGBT7 to the arena of medium power: in the standard industry package EconoDUAL™ 3. In this chip technology, the 1200 V module provides a leading nominal current of 900 A enabling a

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SMALL HOST BASED MODULE WITH WI FI 5 AND BLUETOOTH LOW ENERGY 5

SMALL HOST-BASED MODULE WITH WI-FI 5 AND BLUETOOTH LOW ENERGY 5

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u-blox has introduced the JODY-W2 multiradio module, a feature-rich and compact wireless module for automotive applications. by Ally Winning @ eenewsembedded.com Measuring only a 13.8mm x 19.8mm to address the space constraints that car manufacturers face, the module can operate in temperatures from -40ºC to 105ºC. The module is also well suited for industrial applications. The

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BOXER 8220AI POWERING AI WITH NVIDIA JETSON NANO

BOXER-8220AI: POWERING AI WITH NVIDIA JETSON NANO

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AAEON, an award-winning developer of AI edge computing platforms, announces the BOXER-8220AI box PC powered by NVIDIA® Jetson Nano™. With the latest SoC from NVIDIA built for AI, the BOXER-8220AI offers stable, reliable performance at a price which is competitive and budget friendly. The BOXER-8220AI is powered by the NVIDIA Jetson Nano, the latest in edge computing

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ESP32MX E THE NEW CHIP ON THE BLOCK

ESP32MX-E, THE NEW CHIP ON THE BLOCK

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There are a host of boards based around the ESP32, and also its follow up, the ESP8266. It’s noteworthy to witness how they have evolved from the simple breakout boards they were when the chip was released back in 2015 to something a lot more major. The latest of these boards is the esp32MX-E from Modtronix Engineering, which will be raising soon on Crowd Supply. Measuring

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ENJOY SUPERIOR GRAPHIC OUTPUT AND LOW POWER USAGE WITH ENHANCED EBC 357X 3.5” BOARDS

ENJOY SUPERIOR GRAPHIC OUTPUT AND LOW POWER USAGE WITH ENHANCED EBC 357X 3.5” BOARDS

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NEXCOM is thrilled to reintroduce the SBC EBC 357X series with a revamped design that withstands adverse temperatures and economizes space with its upside-down CPU. The boards save costs by utilizing world-class Intel Atom® E39xx processors, which function as beautifully as i3s without sacrificing speed. Intended for those that desire simple and compact HMIs, the EBC 357X series is suitable for

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Circuits capable of functioning at temperatures

Circuits capable of functioning at temperatures greater than 650 degrees fahrenheit

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(Phys.org) —Engineering researchers at the University of Arkansas have designed integrated circuits that can survive at temperatures greater than 350 degrees Celsius – or roughly 660 degrees Fahrenheit. Their work, funded by the National Science Foundation, will improve the functioning of processors, drivers, controllers and other analog and digital circuits used in power electronics, automobiles

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AI@EDGE COMPACT FANLESS EMBEDDED BOX PC WITH NVIDIA JETSON TX2 AND 4 POE LAN

AI@EDGE COMPACT FANLESS EMBEDDED BOX PC WITH NVIDIA JETSON TX2 AND 4 POE LAN

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AAEON, an industry leader in AI solutions, announces the BOXER-8170AI, our newest embedded AI@Edge computing solution featuring the NVIDIA Jetson TX2. Equipped with four PoE LAN ports and four USB 3.0 ports, the BOXER-8170AI provides stability and flexibility for AI edge networks. The BOXER-8170AI features the powerful NVIDIA Jetson TX2 6-core processor, designed by pairing the Dual Denver 2

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TOSHIBA LAUNCHES NEW FAMILY OF LOW VOLTAGE DRIVEN PHOTORELAYS

TOSHIBA LAUNCHES NEW FAMILY OF LOW VOLTAGE DRIVEN PHOTORELAYS

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Toshiba Electronics Europe GmbH, the industry leader in the miniaturisation of cutting-edge photorelays, introduced a new family of five photorelays housed in one of the industry’s smallest package. The new devices are suited for use in automatic test equipment, memory testers, SoC/LSI testers and probe cards. Both TLP34xxSRL devices and all three of the TLP34xxSRH series have input voltage

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GEN2 650V SIC SCHOTTKY DIODES OFFER IMPROVED EFFICIENCY RELIABILITY AND THERMAL MANAGEMENT

GEN2 650V SIC SCHOTTKY DIODES OFFER IMPROVED EFFICIENCY, RELIABILITY AND THERMAL MANAGEMENT

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Littelfuse, Inc. today introduced two second-generation series of 650V, AEC-Q101-qualified silicon carbide (SiC) Schottky Diodes. The LSIC2SD065CxxA and LSIC2SD065AxxA Series SiC Schottky Diodes are available with a choice of current ratings (6A, 8A, 10A, 16A or 20A). They offer power electronics system designers a variety of performance advantages, including negligible reverse recovery current, high surge capability,

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