semiconductor

ON SEMICONDUCTOR RELEASED THE RSL10 MESH PLATFORM

ON SEMICONDUCTOR RELEASED THE RSL10 MESH PLATFORM

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On Semiconductor released a Bluetooth Low Energy mesh networking solution based on the company’s ultra-low-power RSL10 System-in-Package (RSL10 SIP). The solution has elements needed for the development and deployment of mesh networks. It consists of two RSL10 Mesh Nodes and a Strata Gateway for connectivity to the Strata Developer Studio. Further, sensing and indicator devices were incorporated […]

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PYROELECTRIC PASSIVE INFRARED PIR SENSORS ALLOW FOR EASY INTEGRATION CONFIGURATION AND MORE DESIGN IN POSSIBILITIES

PYROELECTRIC PASSIVE INFRARED (PIR) SENSORS ALLOW FOR EASY INTEGRATION, CONFIGURATION AND MORE DESIGN-IN POSSIBILITIES

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KEMET (“KEMET” or the “Company”), a subsidiary of Yageo Corporation (“Yageo”), a leading global supplier of electronic components, continues to strengthen its solutions for industrial applications with its range of environmental PIR sensors. By utilizing the pyroelectric effect, these thin-film PZT sensors have both high sensitivity and fast response times to ensure rapid and accurate detection of

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OSRAM OPTO SEMICONDUCTORS SPL SXL90A LIDAR QFN PACKAGED SMT LASERS

OSRAM OPTO SEMICONDUCTORS SPL SXL90A LIDAR QFN PACKAGED SMT LASERS

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Osram SPL SxL90A LiDAR QFN Packaged SMT Lasers are infrared high-power SMT components for LiDAR (Light Detection and Ranging) applications. This allows autonomous vehicles to “see” farther and more effectively. The AEC-Q102 qualified four-channel and single-channel pulse lasers offer a performance of 125W at 40A per channel and an efficiency of up to 33%. The single-channel-version (SPL S1L90A_3 A01) offers

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DELO INTRODUCES A NEW ADHESIVE FOR POWER SEMICONDUCTORS

DELO INTRODUCES A NEW ADHESIVE FOR POWER SEMICONDUCTORS

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DELO has developed a new electronic adhesive that is both thermally conductive and electrically insulating and shows good strength even after standardized humidity tests with subsequent reflow cycles. DELO MONOPOX TC2270 ensures fast heat transfer and long-term reliable operation of semiconductors in power electronics. A common reason for the failure of power semiconductors is the heat development

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NORDICS NRF52832 WL CSP SOC PROVIDES PROCESSING POWER AND MULTIPROTOCOL SUPPORT FOR TUNDRA LABS TL448K6D VR MODULE

NORDIC’S NRF52832 WL-CSP SOC PROVIDES PROCESSING POWER AND MULTIPROTOCOL SUPPORT FOR TUNDRA LABS’ TL448K6D-VR MODULE

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Nordic Semiconductor today announces that Tundra Labs, a Green Bay, WI-based technology company, has selected Nordic’s nRF52832 multiprotocol System-on-Chip (SoC) for its ‘TL448K6D-VR module’. The TL448K6D-VR module assists developers to simplify and lower the cost of designing six-degrees-of-freedom (6DoF) tracked devices for Valve’s SteamVR gaming platform. The highly integrated module employs the 3.0 by 3.2mm

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E CON SYSTEMS AND VARISCITE LTD COLLABORATE TO LAUNCH AN ULTRA HD MIPI CAMERA FOR NXP’S I.MX8 FAMILY OF PROCESSORS

E-CON SYSTEMS AND VARISCITE LTD COLLABORATE TO LAUNCH AN ULTRA-HD MIPI CAMERA FOR NXP’S I.MX8 FAMILY OF PROCESSORS

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Following the great demand for a high-resolution camera for i.MX8 processors, e-con Systems has launched a 4-lane MIPI CSI-2 13MP Autofocus camera integrated with Variscite’s i.MX 8 System-on-Module (SoM) platforms. The initial release is compatible with Variscite’s DART-MX8M SoM based on NXP’s iMX8M processor. However, the company has already announced its intentions to expand the

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CELLULAR PANIC BUTTON REVEALS AN NB IOT FUTURE FOR PERSONAL SAFETY ALARMS

CELLULAR PANIC BUTTON REVEALS AN NB-IOT FUTURE FOR PERSONAL SAFETY ALARMS

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Nordic Semiconductor announces that Dutch startup, Montr, is employing Nordic’s nRF9160 multi-protocol LTE-M/NB-IoT System-in-Package (SiP) in a small lithium battery-powered NB-IoT emergency alarm designed to protect people in vulnerable situations such as lone professionals at risk of physical attack or isolated accident, and seniors living at home. The 58 x 42 x 6 to 24mm

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X FAB SILICON FOUNDRIES TAPES OUT OPEN SOURCE RISC V MCU

X-FAB SILICON FOUNDRIES TAPES-OUT OPEN-SOURCE RISC-V MCU

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X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with crowd-sourcing IC platform partner Efabless Corporation, today announced the successful first-silicon availability of the Efabless RISC-V System on Chip (SoC) reference design. This open-source semiconductor project went from design start to tape-out in less than three months using the Efabless design flow based on

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THREE QUANTUM COMPUTER COMPONENTS INTEGRATED ON ONE CHIP

THREE QUANTUM COMPUTER COMPONENTS INTEGRATED ON ONE CHIP

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Scientists at the University of Stuttgart and the KIT succeed in important further development on the way to quantum computers. Quantum computers one day should be able to solve certain computing problems much faster than a classical computer. One of the most promising approaches is based on the utilization of single photons to carry and

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Cypress Semiconductor Serial FRAM Nonvolatile Memory Devices 1

Cypress Semiconductor Serial FRAM Nonvolatile Memory Devices

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Cypress Semiconductor Serial F-RAM (ferroelectric RAM) memories combine the nonvolatile data storage capability of ROM with the fast speeds of RAM. Serial F-RAM features a variety of interface and density options, including SPI and I2C interfaces, industry-standard packages, and densities ranging from 4KB to 4MB. Cypress Serial F-RAMs have three distinct advantages over other nonvolatile

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