A crowdfunding campaign has been launched for a x5-Z8350, 2GB RAM, 16GB flash board called ATOMIC Pi. The IoT board Atomic Pi starts for just $34 plus shipping or $49 with a breakout shield on Kickstarter. The x86 price is on the low side, compared to Aaeon’s $99 UP board or the DFRobot’s $119 LattePanda […]
Intel Atomic Pi SBC Launches for $34 Continue Reading
Cirrus7 has launched an “AI-Box TX2” mini-PC with a Jetson TX2 module with -20 to 70°C extended temperature support. Cirrus7 also offers four Kaby Lake-based mini-PCs and a new Gemini Lake model. The AI-Box TX2 has a similar build like its earlier 7th Gen Kaby Lake-based mini-PCs, but it is the smallest of all with
Cirrus7 Launches AI-Box TX2 and four Kaby Lake-based mini-PCs Continue Reading
Qualcomm announced back in April its QCS605 SoC, calling it “the first 10nm FinFET fabricated SoC, built for the Internet of Things.” The octa-core Arm SoC is available in an Intrinsyc Open-Q 605 SBC with full development kit, including a 12V power supply which is available for pre-order at $429. The product will ship in
Qualcomm Launches 10nm, octa-core QCS605 IoT SoC Continue Reading
RISC architecture is gonna change everything, and I still can’t tell if we like that movie ironically or not. Nevertheless, RISC-V chips are coming onto the market, chipmakers seem really interested in not paying licensing fees, and new hard drives are shipping with RISC-V cores. The latest development in Open instruction sets chips comes from
OPENISA LAUNCHES FREE RISC-V VEGABOARD Continue Reading
The newest LPDDR4 is expected to significantly accelerate the adoption of high capacity mobile DRAM worldwide. The 12Gb LPDDR4 brings the largest capacity and highest speed available for a DRAM chip, while offering excellent energy efficiency, reliability and ease of design – all essential to developing next-generation mobile devices. “By initiating mass production of 12Gb
Samsung launches industry’s first 12Gb LPDDR4 DRAM Continue Reading
Ready for sampling in September, Toshiba’s 48-layer BiCS (Bit Cost Scalable) flash memory stores 256 Gbits using a 3-D vertically stacked cell structure and 3-bit-per-cell triple-level cell technology. By employing this 48-layer vertical stacking process, BiCS flash surpasses the capacity of conventional 2-D NAND flash memory, where cells are arrayed in a planar direction on
Toshiba launches 256-Gbit 48-layer 3-D NAND flash Continue Reading
Eliminated materials and changed processes to reduce thickness and costs to below $1 Sydney, Australia – May 18, 2015 – CAP-XX (LSE:CPX), developer of flat supercapacitors for burst and back-up power in space-constrained electronic devices, today launched its Thinline series of single-cell supercapacitors. The world’s thinnest at 0.6mm thick, and with prices starting at less
CAP-XX launches 0.6mm Thinline supercapacitors Continue Reading
